diff options
| author | Zhang Rui | 2019-05-13 13:58:54 -0400 |
|---|---|---|
| committer | Thomas Gleixner | 2019-05-23 10:08:33 +0200 |
| commit | cfcd82e632882372db960b50782a439a8ba56c09 (patch) | |
| tree | 2706e7c3a24275fcd40f2fa4cca4cc4fca097c69 /Documentation/cputopology.txt | |
| parent | 9ea7612c46586d9eacfd517e73ff76ef294feca0 (diff) | |
hwmon/coretemp: Support multi-die/package
Package temperature sensors are actually implemented in hardware per-die.
Update coretemp to be "die-aware", so it can expose mulitple sensors per
package, instead of just one. No change to single-die/package systems.
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Ingo Molnar <mingo@kernel.org>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org>
Cc: linux-pm@vger.kernel.org
Cc: linux-hwmon@vger.kernel.org
Link: https://lkml.kernel.org/r/ec2868f35113a01ff72d9041e0b97fc6a1c7df84.1557769318.git.len.brown@intel.com
Diffstat (limited to 'Documentation/cputopology.txt')
0 files changed, 0 insertions, 0 deletions