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author | Linus Torvalds | 2021-05-05 12:46:48 -0700 |
---|---|---|
committer | Linus Torvalds | 2021-05-05 12:46:48 -0700 |
commit | 583f2bcf86a322dc0387f5a868026d2e2fe18261 (patch) | |
tree | 9ce028c7f072fc9f2198296cc33b6abe213f537f /Documentation/devicetree | |
parent | 5d6a1b84e07607bc282ed2ed8e2f128c73697d5c (diff) | |
parent | c310e546164d5cca4c12faf9582b75989b030b68 (diff) |
Merge tag 'thermal-v5.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano:
- Remove duplicate error message for the amlogic driver (Tang Bin)
- Fix spellos in comments for the tegra and sun8i (Bhaskar Chowdhury)
- Add the missing fifth node on the rcar_gen3 sensor (Niklas Söderlund)
- Remove duplicate include in ti-bandgap (Zhang Yunkai)
- Assign error code in the error path in the function
thermal_of_populate_bind_params() (Jia-Ju Bai)
- Fix spelling mistake in a comment 'disabed' -> 'disabled' (Colin Ian
King)
- Use the device name instead of auto-numbering for a better
identification of the cooling device (Daniel Lezcano)
- Improve a bit the division accuracy in the power allocator governor
(Jeson Gao)
- Enable the missing third sensor on msm8976 (Konrad Dybcio)
- Add QCom tsens driver co-maintainer (Thara Gopinath)
- Fix memory leak and use after free errors in the core code (Daniel
Lezcano)
- Add the MDM9607 compatible bindings (Konrad Dybcio)
- Fix trivial spello in the copyright name for Hisilicon (Hao Fang)
- Fix negative index array access when converting the frequency to
power in the energy model (Brian-sy Yang)
- Add support for Gen2 new PMIC support for Qcom SPMI (David Collins)
- Update maintainer file for CPU cooling device section (Lukasz Luba)
- Fix missing put_device on error in the Qcom tsens driver (Guangqing
Zhu)
- Add compatible DT binding for sm8350 (Robert Foss)
- Add support for the MDM9607's tsens driver (Konrad Dybcio)
- Remove duplicate error messages in thermal_mmio and the bcm2835
driver (Ruiqi Gong)
- Add the Thermal Temperature Cooling driver (Zhang Rui)
- Remove duplicate error messages in the Hisilicon sensor driver (Ye
Bin)
- Use the devm_platform_ioremap_resource_byname() function instead of a
couple of corresponding calls (dingsenjie)
- Sort the headers alphabetically in the ti-bandgap driver (Zhen Lei)
- Add missing property in the DT thermal sensor binding (Rafał Miłecki)
- Remove dead code in the ti-bandgap sensor driver (Lin Ruizhe)
- Convert the BRCM DT bindings to the yaml schema (Rafał Miłecki)
- Replace the thermal_notify_framework() call by a call to the
thermal_zone_device_update() function. Remove the function as well as
the corresponding documentation (Thara Gopinath)
- Add support for the ipq8064-tsens sensor along with a set of cleanups
and code preparation (Ansuel Smith)
- Add a lockless __thermal_cdev_update() function to improve the
locking scheme in the core code and governors (Lukasz Luba)
- Fix multiple cooling device notification changes (Lukasz Luba)
- Remove unneeded variable initialization (Colin Ian King)
* tag 'thermal-v5.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (55 commits)
thermal/drivers/mtk_thermal: Remove redundant initializations of several variables
thermal/core/power allocator: Use the lockless __thermal_cdev_update() function
thermal/core/fair share: Use the lockless __thermal_cdev_update() function
thermal/core/fair share: Lock the thermal zone while looping over instances
thermal/core/power_allocator: Update once cooling devices when temp is low
thermal/core/power_allocator: Maintain the device statistics from going stale
thermal/core: Create a helper __thermal_cdev_update() without a lock
dt-bindings: thermal: tsens: Document ipq8064 bindings
thermal/drivers/tsens: Add support for ipq8064-tsens
thermal/drivers/tsens: Drop unused define for msm8960
thermal/drivers/tsens: Replace custom 8960 apis with generic apis
thermal/drivers/tsens: Fix bug in sensor enable for msm8960
thermal/drivers/tsens: Use init_common for msm8960
thermal/drivers/tsens: Add VER_0 tsens version
thermal/drivers/tsens: Convert msm8960 to reg_field
thermal/drivers/tsens: Don't hardcode sensor slope
Documentation: driver-api: thermal: Remove thermal_notify_framework from documentation
thermal/core: Remove thermal_notify_framework
iwlwifi: mvm: tt: Replace thermal_notify_framework
dt-bindings: thermal: brcm,ns-thermal: Convert to the json-schema
...
Diffstat (limited to 'Documentation/devicetree')
5 files changed, 149 insertions, 53 deletions
diff --git a/Documentation/devicetree/bindings/thermal/brcm,ns-thermal.txt b/Documentation/devicetree/bindings/thermal/brcm,ns-thermal.txt deleted file mode 100644 index 68e047170039..000000000000 --- a/Documentation/devicetree/bindings/thermal/brcm,ns-thermal.txt +++ /dev/null @@ -1,37 +0,0 @@ -* Broadcom Northstar Thermal - -This binding describes thermal sensor that is part of Northstar's DMU (Device -Management Unit). - -Required properties: -- compatible : Must be "brcm,ns-thermal" -- reg : iomem address range of PVTMON registers -- #thermal-sensor-cells : Should be <0> - -Example: - -thermal: thermal@1800c2c0 { - compatible = "brcm,ns-thermal"; - reg = <0x1800c2c0 0x10>; - #thermal-sensor-cells = <0>; -}; - -thermal-zones { - cpu_thermal: cpu-thermal { - polling-delay-passive = <0>; - polling-delay = <1000>; - coefficients = <(-556) 418000>; - thermal-sensors = <&thermal>; - - trips { - cpu-crit { - temperature = <125000>; - hysteresis = <0>; - type = "critical"; - }; - }; - - cooling-maps { - }; - }; -}; diff --git a/Documentation/devicetree/bindings/thermal/brcm,ns-thermal.yaml b/Documentation/devicetree/bindings/thermal/brcm,ns-thermal.yaml new file mode 100644 index 000000000000..fdeb333e010d --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/brcm,ns-thermal.yaml @@ -0,0 +1,60 @@ +# SPDX-License-Identifier: GPL-2.0-only OR BSD-2-Clause +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/brcm,ns-thermal.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Broadcom Northstar Thermal + +maintainers: + - Rafał Miłecki <rafal@milecki.pl> + +description: + Thermal sensor that is part of Northstar's DMU (Device Management Unit). + +allOf: + - $ref: thermal-sensor.yaml# + +properties: + compatible: + const: brcm,ns-thermal + + reg: + description: PVTMON registers range + maxItems: 1 + + "#thermal-sensor-cells": + const: 0 + +unevaluatedProperties: false + +required: + - reg + +examples: + - | + thermal: thermal@1800c2c0 { + compatible = "brcm,ns-thermal"; + reg = <0x1800c2c0 0x10>; + #thermal-sensor-cells = <0>; + }; + + thermal-zones { + cpu-thermal { + polling-delay-passive = <0>; + polling-delay = <1000>; + coefficients = <(-556) 418000>; + thermal-sensors = <&thermal>; + + trips { + cpu-crit { + temperature = <125000>; + hysteresis = <0>; + type = "critical"; + }; + }; + + cooling-maps { + }; + }; + }; diff --git a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml index 95462e071ab4..0242fd91b622 100644 --- a/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml +++ b/Documentation/devicetree/bindings/thermal/qcom-tsens.yaml @@ -19,9 +19,15 @@ description: | properties: compatible: oneOf: + - description: msm9860 TSENS based + items: + - enum: + - qcom,ipq8064-tsens + - description: v0.1 of TSENS items: - enum: + - qcom,mdm9607-tsens - qcom,msm8916-tsens - qcom,msm8939-tsens - qcom,msm8974-tsens @@ -43,6 +49,7 @@ properties: - qcom,sdm845-tsens - qcom,sm8150-tsens - qcom,sm8250-tsens + - qcom,sm8350-tsens - const: qcom,tsens-v2 reg: @@ -73,7 +80,9 @@ properties: maxItems: 2 items: - const: calib - - const: calib_sel + - enum: + - calib_backup + - calib_sel "#qcom,sensors": description: @@ -88,12 +97,21 @@ properties: Number of cells required to uniquely identify the thermal sensors. Since we have multiple sensors this is set to 1 +required: + - compatible + - interrupts + - interrupt-names + - "#thermal-sensor-cells" + - "#qcom,sensors" + allOf: - if: properties: compatible: contains: enum: + - qcom,ipq8064-tsens + - qcom,mdm9607-tsens - qcom,msm8916-tsens - qcom,msm8974-tsens - qcom,msm8976-tsens @@ -114,19 +132,44 @@ allOf: interrupt-names: minItems: 2 -required: - - compatible - - reg - - "#qcom,sensors" - - interrupts - - interrupt-names - - "#thermal-sensor-cells" + - if: + properties: + compatible: + contains: + enum: + - qcom,tsens-v0_1 + - qcom,tsens-v1 + - qcom,tsens-v2 + + then: + required: + - reg additionalProperties: false examples: - | #include <dt-bindings/interrupt-controller/arm-gic.h> + // Example msm9860 based SoC (ipq8064): + gcc: clock-controller { + + /* ... */ + + tsens: thermal-sensor { + compatible = "qcom,ipq8064-tsens"; + + nvmem-cells = <&tsens_calib>, <&tsens_calib_backup>; + nvmem-cell-names = "calib", "calib_backup"; + interrupts = <GIC_SPI 178 IRQ_TYPE_LEVEL_HIGH>; + interrupt-names = "uplow"; + + #qcom,sensors = <11>; + #thermal-sensor-cells = <1>; + }; + }; + + - | + #include <dt-bindings/interrupt-controller/arm-gic.h> // Example 1 (legacy: for pre v1 IP): tsens1: thermal-sensor@900000 { compatible = "qcom,msm8916-tsens", "qcom,tsens-v0_1"; diff --git a/Documentation/devicetree/bindings/thermal/rcar-gen3-thermal.yaml b/Documentation/devicetree/bindings/thermal/rcar-gen3-thermal.yaml index b33a76eeac4e..f963204e0b16 100644 --- a/Documentation/devicetree/bindings/thermal/rcar-gen3-thermal.yaml +++ b/Documentation/devicetree/bindings/thermal/rcar-gen3-thermal.yaml @@ -28,14 +28,7 @@ properties: - renesas,r8a77980-thermal # R-Car V3H - renesas,r8a779a0-thermal # R-Car V3U - reg: - minItems: 2 - maxItems: 4 - items: - - description: TSC1 registers - - description: TSC2 registers - - description: TSC3 registers - - description: TSC4 registers + reg: true interrupts: items: @@ -71,8 +64,25 @@ if: enum: - renesas,r8a779a0-thermal then: + properties: + reg: + minItems: 2 + maxItems: 3 + items: + - description: TSC1 registers + - description: TSC2 registers + - description: TSC3 registers required: - interrupts +else: + properties: + reg: + items: + - description: TSC0 registers + - description: TSC1 registers + - description: TSC2 registers + - description: TSC3 registers + - description: TSC4 registers additionalProperties: false @@ -111,3 +121,20 @@ examples: }; }; }; + - | + #include <dt-bindings/clock/r8a779a0-cpg-mssr.h> + #include <dt-bindings/interrupt-controller/arm-gic.h> + #include <dt-bindings/power/r8a779a0-sysc.h> + + tsc_r8a779a0: thermal@e6190000 { + compatible = "renesas,r8a779a0-thermal"; + reg = <0xe6190000 0x200>, + <0xe6198000 0x200>, + <0xe61a0000 0x200>, + <0xe61a8000 0x200>, + <0xe61b0000 0x200>; + clocks = <&cpg CPG_MOD 919>; + power-domains = <&sysc R8A779A0_PD_ALWAYS_ON>; + resets = <&cpg 919>; + #thermal-sensor-cells = <1>; + }; diff --git a/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml b/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml index 9f747921e851..4bd345c71eb8 100644 --- a/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml +++ b/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml @@ -36,6 +36,9 @@ properties: containing several internal sensors. enum: [0, 1] +required: + - "#thermal-sensor-cells" + additionalProperties: true examples: |