diff options
| author | Len Brown | 2019-05-13 13:58:46 -0400 |
|---|---|---|
| committer | Thomas Gleixner | 2019-05-23 10:08:30 +0200 |
| commit | 14d96d6c06b5d8116b8d52c9c5530f5528ef1e61 (patch) | |
| tree | 0cb747fc84cfc5431fd6e3b1f8c5f358148a8057 /Documentation/vfio-mediated-device.txt | |
| parent | 7745f03eb39587dd15a1fb26e6223678b8e906d2 (diff) | |
x86/topology: Create topology_max_die_per_package()
topology_max_packages() is available to size resources to cover all
packages in the system.
But now multi-die/package systems are coming up, and some resources are
per-die.
Create topology_max_die_per_package(), for detecting multi-die/package
systems, and sizing any per-die resources.
Signed-off-by: Len Brown <len.brown@intel.com>
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Ingo Molnar <mingo@kernel.org>
Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org>
Link: https://lkml.kernel.org/r/e6eaf384571ae52ac7d0ca41510b7fb7d2fda0e4.1557769318.git.len.brown@intel.com
Diffstat (limited to 'Documentation/vfio-mediated-device.txt')
0 files changed, 0 insertions, 0 deletions