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| author | Len Brown | 2019-05-13 13:58:45 -0400 |
|---|---|---|
| committer | Thomas Gleixner | 2019-05-23 10:08:30 +0200 |
| commit | 7745f03eb39587dd15a1fb26e6223678b8e906d2 (patch) | |
| tree | 77b80b9f708902fe88699b05a3da830cb70b0c91 /Documentation/vfio-mediated-device.txt | |
| parent | a188339ca5a396acc588e5851ed7e19f66b0ebd9 (diff) | |
x86/topology: Add CPUID.1F multi-die/package support
Some new systems have multiple software-visible die within each package.
Update Linux parsing of the Intel CPUID "Extended Topology Leaf" to handle
either CPUID.B, or the new CPUID.1F.
Add cpuinfo_x86.die_id and cpuinfo_x86.max_dies to store the result.
die_id will be non-zero only for multi-die/package systems.
Signed-off-by: Len Brown <len.brown@intel.com>
Signed-off-by: Thomas Gleixner <tglx@linutronix.de>
Reviewed-by: Ingo Molnar <mingo@kernel.org>
Acked-by: Peter Zijlstra (Intel) <peterz@infradead.org>
Cc: linux-doc@vger.kernel.org
Link: https://lkml.kernel.org/r/7b23d2d26d717b8e14ba137c94b70943f1ae4b5c.1557769318.git.len.brown@intel.com
Diffstat (limited to 'Documentation/vfio-mediated-device.txt')
0 files changed, 0 insertions, 0 deletions