Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux

Pull thermal management updates from Zhang Rui:
 "Specifics:

   - enhance Thermal Framework with several new capabilities:

       * use power estimates
       * compute weights with relative integers instead of percentages
       * allow governors to have private data in thermal zones
       * export thermal zone parameters through sysfs

     Thanks to the ARM thermal team (Javi, Punit, KP).

   - introduce a new thermal governor: power allocator.  First in kernel
     closed loop PI(D) controller for thermal control.  Thanks to ARM
     thermal team.

   - enhance OF thermal to allow thermal zones to have sustainable power
     HW specification.  Thanks to Punit.

   - introduce thermal driver for Intel Quark SoC x1000platform.  Thanks
     to Ong, Boon Leong.

   - introduce QPNP PMIC temperature alarm driver.  Thanks to Ivan T. I.

   - introduce thermal driver for Hisilicon hi6220.  Thanks to
     kongxinwei.

   - enhance Exynos thermal driver to handle Exynos5433 TMU.  Thanks to
     Chanwoo C.

   - TI thermal driver now has a better implementation for EOCZ bit.
     From Pavel M.

   - add id for Skylake processors in int340x processor thermal driver.

   - a couple of small fixes and cleanups."

* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (36 commits)
  thermal: hisilicon: add new hisilicon thermal sensor driver
  dt-bindings: Document the hi6220 thermal sensor bindings
  thermal: of-thermal: add support for reading coefficients property
  thermal: support slope and offset coefficients
  thermal: power_allocator: round the division when divvying up power
  thermal: exynos: Add the support for Exynos5433 TMU
  thermal: cpu_cooling: Fix power calculation when CPUs are offline
  thermal: cpu_cooling: Remove cpu_dev update on policy CPU update
  thermal: export thermal_zone_parameters to sysfs
  thermal: cpu_cooling: Check memory allocation of power_table
  ti-soc-thermal: request temperature periodically if hw can't do that itself
  ti-soc-thermal: implement eocz bit to make driver useful on omap3
  cleanup ti-soc-thermal
  thermal: remove stale THERMAL_POWER_ACTOR select
  thermal: Default OF created trip points to writable
  thermal: core: Add Kconfig option to enable writable trips
  thermal: x86_pkg_temp: drop const for thermal_zone_parameters
  of: thermal: Introduce sustainable power for a thermal zone
  thermal: add trace events to the power allocator governor
  thermal: introduce the Power Allocator governor
  ...

6 files changed, 585 insertions, 6 deletions

diff --git a/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
new file mode 100644
index 000000000000..d48fc5280d5a
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/hisilicon-thermal.txt
@@ -0,0 +1,23 @@
+* Temperature Sensor on hisilicon SoCs
+
+** Required properties :
+
+- compatible: "hisilicon,tsensor".
+- reg: physical base address of thermal sensor and length of memory mapped
+  region.
+- interrupt: The interrupt number to the cpu. Defines the interrupt used
+  by /SOCTHERM/tsensor.
+- clock-names: Input clock name, should be 'thermal_clk'.
+- clocks: phandles for clock specified in "clock-names" property.
+- #thermal-sensor-cells: Should be 1. See ./thermal.txt for a description.
+
+Example :
+
+	tsensor: tsensor@0,f7030700 {
+		compatible = "hisilicon,tsensor";
+		reg = <0x0 0xf7030700 0x0 0x1000>;
+		interrupts = <0 7 0x4>;
+		clocks = <&sys_ctrl HI6220_TSENSOR_CLK>;
+		clock-names = "thermal_clk";
+		#thermal-sensor-cells = <1>;
+	}
diff --git a/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt b/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt
new file mode 100644
index 000000000000..290ec06fa33a
--- /dev/null
+++ b/Documentation/devicetree/bindings/thermal/qcom-spmi-temp-alarm.txt
@@ -0,0 +1,57 @@
+Qualcomm QPNP PMIC Temperature Alarm
+
+QPNP temperature alarm peripherals are found inside of Qualcomm PMIC chips
+that utilize the Qualcomm SPMI implementation. These peripherals provide an
+interrupt signal and status register to identify high PMIC die temperature.
+
+Required properties:
+- compatible:      Should contain "qcom,spmi-temp-alarm".
+- reg:             Specifies the SPMI address and length of the controller's
+                   registers.
+- interrupts:      PMIC temperature alarm interrupt.
+- #thermal-sensor-cells: Should be 0. See thermal.txt for a description.
+
+Optional properties:
+- io-channels:     Should contain IIO channel specifier for the ADC channel,
+                   which report chip die temperature.
+- io-channel-names: Should contain "thermal".
+
+Example:
+
+	pm8941_temp: thermal-alarm@2400 {
+		compatible = "qcom,spmi-temp-alarm";
+		reg = <0x2400 0x100>;
+		interrupts = <0 0x24 0 IRQ_TYPE_EDGE_RISING>;
+		#thermal-sensor-cells = <0>;
+
+		io-channels = <&pm8941_vadc VADC_DIE_TEMP>;
+		io-channel-names = "thermal";
+	};
+
+	thermal-zones {
+		pm8941 {
+			polling-delay-passive = <250>;
+			polling-delay = <1000>;
+
+			thermal-sensors = <&pm8941_temp>;
+
+			trips {
+				passive {
+					temperature = <1050000>;
+					hysteresis = <2000>;
+					type = "passive";
+				};
+				alert {
+					temperature = <125000>;
+					hysteresis = <2000>;
+					type = "hot";
+				};
+				crit {
+					temperature = <145000>;
+					hysteresis = <2000>;
+					type = "critical";
+				};
+			};
+		};
+	};
+
diff --git a/Documentation/devicetree/bindings/thermal/thermal.txt b/Documentation/devicetree/bindings/thermal/thermal.txt
index 29fe0bfae38e..8a49362dea6e 100644
--- a/Documentation/devicetree/bindings/thermal/thermal.txt
+++ b/Documentation/devicetree/bindings/thermal/thermal.txt
@@ -167,6 +167,13 @@ Optional property:
 			by means of sensor ID. Additional coefficients are
 			interpreted as constant offset.
 
+- sustainable-power:	An estimate of the sustainable power (in mW) that the
+  Type: unsigned	thermal zone can dissipate at the desired
+  Size: one cell	control temperature.  For reference, the
+			sustainable power of a 4'' phone is typically
+			2000mW, while on a 10'' tablet is around
+			4500mW.
+
 Note: The delay properties are bound to the maximum dT/dt (temperature
 derivative over time) in two situations for a thermal zone:
 (i)  - when passive cooling is activated (polling-delay-passive); and
@@ -546,6 +553,8 @@ thermal-zones {
 		 */
 		coefficients =		<1200	-345	890>;
 
+		sustainable-power = <2500>;
+
 		trips {
 			/* Trips are based on resulting linear equation */
 			cpu_trip: cpu-trip {
diff --git a/Documentation/thermal/cpu-cooling-api.txt b/Documentation/thermal/cpu-cooling-api.txt
index 753e47cc2e20..71653584cd03 100644
--- a/Documentation/thermal/cpu-cooling-api.txt
+++ b/Documentation/thermal/cpu-cooling-api.txt
@@ -36,8 +36,162 @@ the user. The registration APIs returns the cooling device pointer.
     np: pointer to the cooling device device tree node
     clip_cpus: cpumask of cpus where the frequency constraints will happen.
 
-1.1.3 void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)
+1.1.3 struct thermal_cooling_device *cpufreq_power_cooling_register(
+    const struct cpumask *clip_cpus, u32 capacitance,
+    get_static_t plat_static_func)
+
+Similar to cpufreq_cooling_register, this function registers a cpufreq
+cooling device.  Using this function, the cooling device will
+implement the power extensions by using a simple cpu power model.  The
+cpus must have registered their OPPs using the OPP library.
+
+The additional parameters are needed for the power model (See 2. Power
+models).  "capacitance" is the dynamic power coefficient (See 2.1
+Dynamic power).  "plat_static_func" is a function to calculate the
+static power consumed by these cpus (See 2.2 Static power).
+
+1.1.4 struct thermal_cooling_device *of_cpufreq_power_cooling_register(
+    struct device_node *np, const struct cpumask *clip_cpus, u32 capacitance,
+    get_static_t plat_static_func)
+
+Similar to cpufreq_power_cooling_register, this function register a
+cpufreq cooling device with power extensions using the device tree
+information supplied by the np parameter.
+
+1.1.5 void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)
 
     This interface function unregisters the "thermal-cpufreq-%x" cooling device.
 
     cdev: Cooling device pointer which has to be unregistered.
+
+2. Power models
+
+The power API registration functions provide a simple power model for
+CPUs.  The current power is calculated as dynamic + (optionally)
+static power.  This power model requires that the operating-points of
+the CPUs are registered using the kernel's opp library and the
+`cpufreq_frequency_table` is assigned to the `struct device` of the
+cpu.  If you are using CONFIG_CPUFREQ_DT then the
+`cpufreq_frequency_table` should already be assigned to the cpu
+device.
+
+The `plat_static_func` parameter of `cpufreq_power_cooling_register()`
+and `of_cpufreq_power_cooling_register()` is optional.  If you don't
+provide it, only dynamic power will be considered.
+
+2.1 Dynamic power
+
+The dynamic power consumption of a processor depends on many factors.
+For a given processor implementation the primary factors are:
+
+- The time the processor spends running, consuming dynamic power, as
+  compared to the time in idle states where dynamic consumption is
+  negligible.  Herein we refer to this as 'utilisation'.
+- The voltage and frequency levels as a result of DVFS.  The DVFS
+  level is a dominant factor governing power consumption.
+- In running time the 'execution' behaviour (instruction types, memory
+  access patterns and so forth) causes, in most cases, a second order
+  variation.  In pathological cases this variation can be significant,
+  but typically it is of a much lesser impact than the factors above.
+
+A high level dynamic power consumption model may then be represented as:
+
+Pdyn = f(run) * Voltage^2 * Frequency * Utilisation
+
+f(run) here represents the described execution behaviour and its
+result has a units of Watts/Hz/Volt^2 (this often expressed in
+mW/MHz/uVolt^2)
+
+The detailed behaviour for f(run) could be modelled on-line.  However,
+in practice, such an on-line model has dependencies on a number of
+implementation specific processor support and characterisation
+factors.  Therefore, in initial implementation that contribution is
+represented as a constant coefficient.  This is a simplification
+consistent with the relative contribution to overall power variation.
+
+In this simplified representation our model becomes:
+
+Pdyn = Capacitance * Voltage^2 * Frequency * Utilisation
+
+Where `capacitance` is a constant that represents an indicative
+running time dynamic power coefficient in fundamental units of
+mW/MHz/uVolt^2.  Typical values for mobile CPUs might lie in range
+from 100 to 500.  For reference, the approximate values for the SoC in
+ARM's Juno Development Platform are 530 for the Cortex-A57 cluster and
+140 for the Cortex-A53 cluster.
+
+
+2.2 Static power
+
+Static leakage power consumption depends on a number of factors.  For a
+given circuit implementation the primary factors are:
+
+- Time the circuit spends in each 'power state'
+- Temperature
+- Operating voltage
+- Process grade
+
+The time the circuit spends in each 'power state' for a given
+evaluation period at first order means OFF or ON.  However,
+'retention' states can also be supported that reduce power during
+inactive periods without loss of context.
+
+Note: The visibility of state entries to the OS can vary, according to
+platform specifics, and this can then impact the accuracy of a model
+based on OS state information alone.  It might be possible in some
+cases to extract more accurate information from system resources.
+
+The temperature, operating voltage and process 'grade' (slow to fast)
+of the circuit are all significant factors in static leakage power
+consumption.  All of these have complex relationships to static power.
+
+Circuit implementation specific factors include the chosen silicon
+process as well as the type, number and size of transistors in both
+the logic gates and any RAM elements included.
+
+The static power consumption modelling must take into account the
+power managed regions that are implemented.  Taking the example of an
+ARM processor cluster, the modelling would take into account whether
+each CPU can be powered OFF separately or if only a single power
+region is implemented for the complete cluster.
+
+In one view, there are others, a static power consumption model can
+then start from a set of reference values for each power managed
+region (e.g. CPU, Cluster/L2) in each state (e.g. ON, OFF) at an
+arbitrary process grade, voltage and temperature point.  These values
+are then scaled for all of the following: the time in each state, the
+process grade, the current temperature and the operating voltage.
+However, since both implementation specific and complex relationships
+dominate the estimate, the appropriate interface to the model from the
+cpu cooling device is to provide a function callback that calculates
+the static power in this platform.  When registering the cpu cooling
+device pass a function pointer that follows the `get_static_t`
+prototype:
+
+    int plat_get_static(cpumask_t *cpumask, int interval,
+                        unsigned long voltage, u32 &power);
+
+`cpumask` is the cpumask of the cpus involved in the calculation.
+`voltage` is the voltage at which they are operating.  The function
+should calculate the average static power for the last `interval`
+milliseconds.  It returns 0 on success, -E* on error.  If it
+succeeds, it should store the static power in `power`.  Reading the
+temperature of the cpus described by `cpumask` is left for
+plat_get_static() to do as the platform knows best which thermal
+sensor is closest to the cpu.
+
+If `plat_static_func` is NULL, static power is considered to be
+negligible for this platform and only dynamic power is considered.
+
+The platform specific callback can then use any combination of tables
+and/or equations to permute the estimated value.  Process grade
+information is not passed to the model since access to such data, from
+on-chip measurement capability or manufacture time data, is platform
+specific.
+
+Note: the significance of static power for CPUs in comparison to
+dynamic power is highly dependent on implementation.  Given the
+potential complexity in implementation, the importance and accuracy of
+its inclusion when using cpu cooling devices should be assessed on a
+case by case basis.
+
diff --git a/Documentation/thermal/power_allocator.txt b/Documentation/thermal/power_allocator.txt
new file mode 100644
index 000000000000..c3797b529991
--- /dev/null
+++ b/Documentation/thermal/power_allocator.txt
@@ -0,0 +1,247 @@
+Power allocator governor tunables
+=================================
+
+Trip points
+-----------
+
+The governor requires the following two passive trip points:
+
+1.  "switch on" trip point: temperature above which the governor
+    control loop starts operating.  This is the first passive trip
+    point of the thermal zone.
+
+2.  "desired temperature" trip point: it should be higher than the
+    "switch on" trip point.  This the target temperature the governor
+    is controlling for.  This is the last passive trip point of the
+    thermal zone.
+
+PID Controller
+--------------
+
+The power allocator governor implements a
+Proportional-Integral-Derivative controller (PID controller) with
+temperature as the control input and power as the controlled output:
+
+    P_max = k_p * e + k_i * err_integral + k_d * diff_err + sustainable_power
+
+where
+    e = desired_temperature - current_temperature
+    err_integral is the sum of previous errors
+    diff_err = e - previous_error
+
+It is similar to the one depicted below:
+
+                                      k_d
+                                       |
+current_temp                           |
+     |                                 v
+     |                +----------+   +---+
+     |         +----->| diff_err |-->| X |------+
+     |         |      +----------+   +---+      |
+     |         |                                |      tdp        actor
+     |         |                      k_i       |       |  get_requested_power()
+     |         |                       |        |       |        |     |
+     |         |                       |        |       |        |     | ...
+     v         |                       v        v       v        v     v
+   +---+       |      +-------+      +---+    +---+   +---+   +----------+
+   | S |-------+----->| sum e |----->| X |--->| S |-->| S |-->|power     |
+   +---+       |      +-------+      +---+    +---+   +---+   |allocation|
+     ^         |                                ^             +----------+
+     |         |                                |                |     |
+     |         |        +---+                   |                |     |
+     |         +------->| X |-------------------+                v     v
+     |                  +---+                               granted performance
+desired_temperature       ^
+                          |
+                          |
+                      k_po/k_pu
+
+Sustainable power
+-----------------
+
+An estimate of the sustainable dissipatable power (in mW) should be
+provided while registering the thermal zone.  This estimates the
+sustained power that can be dissipated at the desired control
+temperature.  This is the maximum sustained power for allocation at
+the desired maximum temperature.  The actual sustained power can vary
+for a number of reasons.  The closed loop controller will take care of
+variations such as environmental conditions, and some factors related
+to the speed-grade of the silicon.  `sustainable_power` is therefore
+simply an estimate, and may be tuned to affect the aggressiveness of
+the thermal ramp. For reference, the sustainable power of a 4" phone
+is typically 2000mW, while on a 10" tablet is around 4500mW (may vary
+depending on screen size).
+
+If you are using device tree, do add it as a property of the
+thermal-zone.  For example:
+
+	thermal-zones {
+		soc_thermal {
+			polling-delay = <1000>;
+			polling-delay-passive = <100>;
+			sustainable-power = <2500>;
+			...
+
+Instead, if the thermal zone is registered from the platform code, pass a
+`thermal_zone_params` that has a `sustainable_power`.  If no
+`thermal_zone_params` were being passed, then something like below
+will suffice:
+
+	static const struct thermal_zone_params tz_params = {
+		.sustainable_power = 3500,
+	};
+
+and then pass `tz_params` as the 5th parameter to
+`thermal_zone_device_register()`
+
+k_po and k_pu
+-------------
+
+The implementation of the PID controller in the power allocator
+thermal governor allows the configuration of two proportional term
+constants: `k_po` and `k_pu`.  `k_po` is the proportional term
+constant during temperature overshoot periods (current temperature is
+above "desired temperature" trip point).  Conversely, `k_pu` is the
+proportional term constant during temperature undershoot periods
+(current temperature below "desired temperature" trip point).
+
+These controls are intended as the primary mechanism for configuring
+the permitted thermal "ramp" of the system.  For instance, a lower
+`k_pu` value will provide a slower ramp, at the cost of capping
+available capacity at a low temperature.  On the other hand, a high
+value of `k_pu` will result in the governor granting very high power
+whilst temperature is low, and may lead to temperature overshooting.
+
+The default value for `k_pu` is:
+
+    2 * sustainable_power / (desired_temperature - switch_on_temp)
+
+This means that at `switch_on_temp` the output of the controller's
+proportional term will be 2 * `sustainable_power`.  The default value
+for `k_po` is:
+
+    sustainable_power / (desired_temperature - switch_on_temp)
+
+Focusing on the proportional and feed forward values of the PID
+controller equation we have:
+
+    P_max = k_p * e + sustainable_power
+
+The proportional term is proportional to the difference between the
+desired temperature and the current one.  When the current temperature
+is the desired one, then the proportional component is zero and
+`P_max` = `sustainable_power`.  That is, the system should operate in
+thermal equilibrium under constant load.  `sustainable_power` is only
+an estimate, which is the reason for closed-loop control such as this.
+
+Expanding `k_pu` we get:
+    P_max = 2 * sustainable_power * (T_set - T) / (T_set - T_on) +
+        sustainable_power
+
+where
+    T_set is the desired temperature
+    T is the current temperature
+    T_on is the switch on temperature
+
+When the current temperature is the switch_on temperature, the above
+formula becomes:
+
+    P_max = 2 * sustainable_power * (T_set - T_on) / (T_set - T_on) +
+        sustainable_power = 2 * sustainable_power + sustainable_power =
+        3 * sustainable_power
+
+Therefore, the proportional term alone linearly decreases power from
+3 * `sustainable_power` to `sustainable_power` as the temperature
+rises from the switch on temperature to the desired temperature.
+
+k_i and integral_cutoff
+-----------------------
+
+`k_i` configures the PID loop's integral term constant.  This term
+allows the PID controller to compensate for long term drift and for
+the quantized nature of the output control: cooling devices can't set
+the exact power that the governor requests.  When the temperature
+error is below `integral_cutoff`, errors are accumulated in the
+integral term.  This term is then multiplied by `k_i` and the result
+added to the output of the controller.  Typically `k_i` is set low (1
+or 2) and `integral_cutoff` is 0.
+
+k_d
+---
+
+`k_d` configures the PID loop's derivative term constant.  It's
+recommended to leave it as the default: 0.
+
+Cooling device power API
+========================
+
+Cooling devices controlled by this governor must supply the additional
+"power" API in their `cooling_device_ops`.  It consists on three ops:
+
+1. int get_requested_power(struct thermal_cooling_device *cdev,
+	struct thermal_zone_device *tz, u32 *power);
+@cdev: The `struct thermal_cooling_device` pointer
+@tz: thermal zone in which we are currently operating
+@power: pointer in which to store the calculated power
+
+`get_requested_power()` calculates the power requested by the device
+in milliwatts and stores it in @power .  It should return 0 on
+success, -E* on failure.  This is currently used by the power
+allocator governor to calculate how much power to give to each cooling
+device.
+
+2. int state2power(struct thermal_cooling_device *cdev, struct
+        thermal_zone_device *tz, unsigned long state, u32 *power);
+@cdev: The `struct thermal_cooling_device` pointer
+@tz: thermal zone in which we are currently operating
+@state: A cooling device state
+@power: pointer in which to store the equivalent power
+
+Convert cooling device state @state into power consumption in
+milliwatts and store it in @power.  It should return 0 on success, -E*
+on failure.  This is currently used by thermal core to calculate the
+maximum power that an actor can consume.
+
+3. int power2state(struct thermal_cooling_device *cdev, u32 power,
+	unsigned long *state);
+@cdev: The `struct thermal_cooling_device` pointer
+@power: power in milliwatts
+@state: pointer in which to store the resulting state
+
+Calculate a cooling device state that would make the device consume at
+most @power mW and store it in @state.  It should return 0 on success,
+-E* on failure.  This is currently used by the thermal core to convert
+a given power set by the power allocator governor to a state that the
+cooling device can set.  It is a function because this conversion may
+depend on external factors that may change so this function should the
+best conversion given "current circumstances".
+
+Cooling device weights
+----------------------
+
+Weights are a mechanism to bias the allocation among cooling
+devices.  They express the relative power efficiency of different
+cooling devices.  Higher weight can be used to express higher power
+efficiency.  Weighting is relative such that if each cooling device
+has a weight of one they are considered equal.  This is particularly
+useful in heterogeneous systems where two cooling devices may perform
+the same kind of compute, but with different efficiency.  For example,
+a system with two different types of processors.
+
+If the thermal zone is registered using
+`thermal_zone_device_register()` (i.e., platform code), then weights
+are passed as part of the thermal zone's `thermal_bind_parameters`.
+If the platform is registered using device tree, then they are passed
+as the `contribution` property of each map in the `cooling-maps` node.
+
+Limitations of the power allocator governor
+===========================================
+
+The power allocator governor's PID controller works best if there is a
+periodic tick.  If you have a driver that calls
+`thermal_zone_device_update()` (or anything that ends up calling the
+governor's `throttle()` function) repetitively, the governor response
+won't be very good.  Note that this is not particular to this
+governor, step-wise will also misbehave if you call its throttle()
+faster than the normal thermal framework tick (due to interrupts for
+example) as it will overreact.
diff --git a/Documentation/thermal/sysfs-api.txt b/Documentation/thermal/sysfs-api.txt
index 87519cb379ee..c1f6864a8c5d 100644
--- a/Documentation/thermal/sysfs-api.txt
+++ b/Documentation/thermal/sysfs-api.txt
@@ -95,7 +95,7 @@ temperature) and throttle appropriate devices.
 1.3 interface for binding a thermal zone device with a thermal cooling device
 1.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz,
 	int trip, struct thermal_cooling_device *cdev,
-	unsigned long upper, unsigned long lower);
+	unsigned long upper, unsigned long lower, unsigned int weight);
 
     This interface function bind a thermal cooling device to the certain trip
     point of a thermal zone device.
@@ -110,6 +110,8 @@ temperature) and throttle appropriate devices.
     lower:the Minimum cooling state can be used for this trip point.
           THERMAL_NO_LIMIT means no lower limit,
 	  and the cooling device can be in cooling state 0.
+    weight: the influence of this cooling device in this thermal
+            zone.  See 1.4.1 below for more information.
 
 1.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz,
 		int trip, struct thermal_cooling_device *cdev);
@@ -127,9 +129,15 @@ temperature) and throttle appropriate devices.
     This structure defines the following parameters that are used to bind
     a zone with a cooling device for a particular trip point.
     .cdev: The cooling device pointer
-    .weight: The 'influence' of a particular cooling device on this zone.
-             This is on a percentage scale. The sum of all these weights
-             (for a particular zone) cannot exceed 100.
+    .weight: The 'influence' of a particular cooling device on this
+             zone. This is relative to the rest of the cooling
+             devices. For example, if all cooling devices have a
+             weight of 1, then they all contribute the same. You can
+             use percentages if you want, but it's not mandatory. A
+             weight of 0 means that this cooling device doesn't
+             contribute to the cooling of this zone unless all cooling
+             devices have a weight of 0. If all weights are 0, then
+             they all contribute the same.
     .trip_mask:This is a bit mask that gives the binding relation between
                this thermal zone and cdev, for a particular trip point.
                If nth bit is set, then the cdev and thermal zone are bound
@@ -176,6 +184,14 @@ Thermal zone device sys I/F, created once it's registered:
     |---trip_point_[0-*]_type:	Trip point type
     |---trip_point_[0-*]_hyst:	Hysteresis value for this trip point
     |---emul_temp:		Emulated temperature set node
+    |---sustainable_power:      Sustainable dissipatable power
+    |---k_po:                   Proportional term during temperature overshoot
+    |---k_pu:                   Proportional term during temperature undershoot
+    |---k_i:                    PID's integral term in the power allocator gov
+    |---k_d:                    PID's derivative term in the power allocator
+    |---integral_cutoff:        Offset above which errors are accumulated
+    |---slope:                  Slope constant applied as linear extrapolation
+    |---offset:                 Offset constant applied as linear extrapolation
 
 Thermal cooling device sys I/F, created once it's registered:
 /sys/class/thermal/cooling_device[0-*]:
@@ -192,6 +208,8 @@ thermal_zone_bind_cooling_device/thermal_zone_unbind_cooling_device.
 /sys/class/thermal/thermal_zone[0-*]:
     |---cdev[0-*]:		[0-*]th cooling device in current thermal zone
     |---cdev[0-*]_trip_point:	Trip point that cdev[0-*] is associated with
+    |---cdev[0-*]_weight:       Influence of the cooling device in
+                                this thermal zone
 
 Besides the thermal zone device sysfs I/F and cooling device sysfs I/F,
 the generic thermal driver also creates a hwmon sysfs I/F for each _type_
@@ -265,6 +283,14 @@ cdev[0-*]_trip_point
 	point.
 	RO, Optional
 
+cdev[0-*]_weight
+        The influence of cdev[0-*] in this thermal zone. This value
+        is relative to the rest of cooling devices in the thermal
+        zone. For example, if a cooling device has a weight double
+        than that of other, it's twice as effective in cooling the
+        thermal zone.
+        RW, Optional
+
 passive
 	Attribute is only present for zones in which the passive cooling
 	policy is not supported by native thermal driver. Default is zero
@@ -289,6 +315,66 @@ emul_temp
 	  because userland can easily disable the thermal policy by simply
 	  flooding this sysfs node with low temperature values.
 
+sustainable_power
+	An estimate of the sustained power that can be dissipated by
+	the thermal zone. Used by the power allocator governor. For
+	more information see Documentation/thermal/power_allocator.txt
+	Unit: milliwatts
+	RW, Optional
+
+k_po
+	The proportional term of the power allocator governor's PID
+	controller during temperature overshoot. Temperature overshoot
+	is when the current temperature is above the "desired
+	temperature" trip point. For more information see
+	Documentation/thermal/power_allocator.txt
+	RW, Optional
+
+k_pu
+	The proportional term of the power allocator governor's PID
+	controller during temperature undershoot. Temperature undershoot
+	is when the current temperature is below the "desired
+	temperature" trip point. For more information see
+	Documentation/thermal/power_allocator.txt
+	RW, Optional
+
+k_i
+	The integral term of the power allocator governor's PID
+	controller. This term allows the PID controller to compensate
+	for long term drift. For more information see
+	Documentation/thermal/power_allocator.txt
+	RW, Optional
+
+k_d
+	The derivative term of the power allocator governor's PID
+	controller. For more information see
+	Documentation/thermal/power_allocator.txt
+	RW, Optional
+
+integral_cutoff
+	Temperature offset from the desired temperature trip point
+	above which the integral term of the power allocator
+	governor's PID controller starts accumulating errors. For
+	example, if integral_cutoff is 0, then the integral term only
+	accumulates error when temperature is above the desired
+	temperature trip point. For more information see
+	Documentation/thermal/power_allocator.txt
+	RW, Optional
+
+slope
+	The slope constant used in a linear extrapolation model
+	to determine a hotspot temperature based off the sensor's
+	raw readings. It is up to the device driver to determine
+	the usage of these values.
+	RW, Optional
+
+offset
+	The offset constant used in a linear extrapolation model
+	to determine a hotspot temperature based off the sensor's
+	raw readings. It is up to the device driver to determine
+	the usage of these values.
+	RW, Optional
+
 *****************************
 * Cooling device attributes *
 *****************************
@@ -318,7 +404,8 @@ passive, active. If an ACPI thermal zone supports critical, passive,
 active[0] and active[1] at the same time, it may register itself as a
 thermal_zone_device (thermal_zone1) with 4 trip points in all.
 It has one processor and one fan, which are both registered as
-thermal_cooling_device.
+thermal_cooling_device. Both are considered to have the same
+effectiveness in cooling the thermal zone.
 
 If the processor is listed in _PSL method, and the fan is listed in _AL0
 method, the sys I/F structure will be built like this:
@@ -340,8 +427,10 @@ method, the sys I/F structure will be built like this:
     |---trip_point_3_type:	active1
     |---cdev0:			--->/sys/class/thermal/cooling_device0
     |---cdev0_trip_point:	1	/* cdev0 can be used for passive */
+    |---cdev0_weight:           1024
     |---cdev1:			--->/sys/class/thermal/cooling_device3
     |---cdev1_trip_point:	2	/* cdev1 can be used for active[0]*/
+    |---cdev1_weight:           1024
 
 |cooling_device0:
     |---type:			Processor