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authorLinus Torvalds2021-05-05 12:46:48 -0700
committerLinus Torvalds2021-05-05 12:46:48 -0700
commit583f2bcf86a322dc0387f5a868026d2e2fe18261 (patch)
tree9ce028c7f072fc9f2198296cc33b6abe213f537f /include/linux
parent5d6a1b84e07607bc282ed2ed8e2f128c73697d5c (diff)
parentc310e546164d5cca4c12faf9582b75989b030b68 (diff)
Merge tag 'thermal-v5.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano: - Remove duplicate error message for the amlogic driver (Tang Bin) - Fix spellos in comments for the tegra and sun8i (Bhaskar Chowdhury) - Add the missing fifth node on the rcar_gen3 sensor (Niklas Söderlund) - Remove duplicate include in ti-bandgap (Zhang Yunkai) - Assign error code in the error path in the function thermal_of_populate_bind_params() (Jia-Ju Bai) - Fix spelling mistake in a comment 'disabed' -> 'disabled' (Colin Ian King) - Use the device name instead of auto-numbering for a better identification of the cooling device (Daniel Lezcano) - Improve a bit the division accuracy in the power allocator governor (Jeson Gao) - Enable the missing third sensor on msm8976 (Konrad Dybcio) - Add QCom tsens driver co-maintainer (Thara Gopinath) - Fix memory leak and use after free errors in the core code (Daniel Lezcano) - Add the MDM9607 compatible bindings (Konrad Dybcio) - Fix trivial spello in the copyright name for Hisilicon (Hao Fang) - Fix negative index array access when converting the frequency to power in the energy model (Brian-sy Yang) - Add support for Gen2 new PMIC support for Qcom SPMI (David Collins) - Update maintainer file for CPU cooling device section (Lukasz Luba) - Fix missing put_device on error in the Qcom tsens driver (Guangqing Zhu) - Add compatible DT binding for sm8350 (Robert Foss) - Add support for the MDM9607's tsens driver (Konrad Dybcio) - Remove duplicate error messages in thermal_mmio and the bcm2835 driver (Ruiqi Gong) - Add the Thermal Temperature Cooling driver (Zhang Rui) - Remove duplicate error messages in the Hisilicon sensor driver (Ye Bin) - Use the devm_platform_ioremap_resource_byname() function instead of a couple of corresponding calls (dingsenjie) - Sort the headers alphabetically in the ti-bandgap driver (Zhen Lei) - Add missing property in the DT thermal sensor binding (Rafał Miłecki) - Remove dead code in the ti-bandgap sensor driver (Lin Ruizhe) - Convert the BRCM DT bindings to the yaml schema (Rafał Miłecki) - Replace the thermal_notify_framework() call by a call to the thermal_zone_device_update() function. Remove the function as well as the corresponding documentation (Thara Gopinath) - Add support for the ipq8064-tsens sensor along with a set of cleanups and code preparation (Ansuel Smith) - Add a lockless __thermal_cdev_update() function to improve the locking scheme in the core code and governors (Lukasz Luba) - Fix multiple cooling device notification changes (Lukasz Luba) - Remove unneeded variable initialization (Colin Ian King) * tag 'thermal-v5.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (55 commits) thermal/drivers/mtk_thermal: Remove redundant initializations of several variables thermal/core/power allocator: Use the lockless __thermal_cdev_update() function thermal/core/fair share: Use the lockless __thermal_cdev_update() function thermal/core/fair share: Lock the thermal zone while looping over instances thermal/core/power_allocator: Update once cooling devices when temp is low thermal/core/power_allocator: Maintain the device statistics from going stale thermal/core: Create a helper __thermal_cdev_update() without a lock dt-bindings: thermal: tsens: Document ipq8064 bindings thermal/drivers/tsens: Add support for ipq8064-tsens thermal/drivers/tsens: Drop unused define for msm8960 thermal/drivers/tsens: Replace custom 8960 apis with generic apis thermal/drivers/tsens: Fix bug in sensor enable for msm8960 thermal/drivers/tsens: Use init_common for msm8960 thermal/drivers/tsens: Add VER_0 tsens version thermal/drivers/tsens: Convert msm8960 to reg_field thermal/drivers/tsens: Don't hardcode sensor slope Documentation: driver-api: thermal: Remove thermal_notify_framework from documentation thermal/core: Remove thermal_notify_framework iwlwifi: mvm: tt: Replace thermal_notify_framework dt-bindings: thermal: brcm,ns-thermal: Convert to the json-schema ...
Diffstat (limited to 'include/linux')
-rw-r--r--include/linux/thermal.h7
1 files changed, 1 insertions, 6 deletions
diff --git a/include/linux/thermal.h b/include/linux/thermal.h
index 6ac7bb1d2b1f..d296f3b88fb9 100644
--- a/include/linux/thermal.h
+++ b/include/linux/thermal.h
@@ -91,7 +91,7 @@ struct thermal_cooling_device_ops {
struct thermal_cooling_device {
int id;
- char type[THERMAL_NAME_LENGTH];
+ char *type;
struct device device;
struct device_node *np;
void *devdata;
@@ -390,7 +390,6 @@ int thermal_zone_get_temp(struct thermal_zone_device *tz, int *temp);
int thermal_zone_get_slope(struct thermal_zone_device *tz);
int thermal_zone_get_offset(struct thermal_zone_device *tz);
-void thermal_notify_framework(struct thermal_zone_device *, int);
int thermal_zone_device_enable(struct thermal_zone_device *tz);
int thermal_zone_device_disable(struct thermal_zone_device *tz);
void thermal_zone_device_critical(struct thermal_zone_device *tz);
@@ -436,10 +435,6 @@ static inline int thermal_zone_get_offset(
struct thermal_zone_device *tz)
{ return -ENODEV; }
-static inline void thermal_notify_framework(struct thermal_zone_device *tz,
- int trip)
-{ }
-
static inline int thermal_zone_device_enable(struct thermal_zone_device *tz)
{ return -ENODEV; }