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authorJean-Francois Dagenais2019-04-18 20:57:22 -0400
committerGuenter Roeck2019-04-20 07:08:15 -0700
commit4f8d374b770a2e26088186d6c18acf582227129d (patch)
tree4be6838793c8bf4b86e964828321731a3446475d /lib
parent023912dbb80f5faf7a028aad6562774472d82a5a (diff)
hwmon: (max6650) add thermal cooling device capability
This allows max6650 devices to be referenced in dts as a cooling device. The pwm value seems duplicated in cooling_dev_state but since pwm goes through rounding logic into data->dac, it is modified and messes with the thermal zone state algorithms. It's also better to serve a cache value, thus avoiding periodic actual i2c traffic. Signed-off-by: Jean-Francois Dagenais <jeff.dagenais@gmail.com> Signed-off-by: Guenter Roeck <linux@roeck-us.net>
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