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authorDurgadoss R2012-09-18 11:04:59 +0530
committerZhang Rui2012-11-05 14:00:06 +0800
commit7e8ee1e9d7561fe640ae8df6c28f10a6a3239592 (patch)
tree62424e9e873cf857727d6ce9803f2dc73647a561 /mm/highmem.c
parent5a2c090b3327353a78232182f2c7fcd69a46eff0 (diff)
Thermal: Update binding logic based on platform data
This patch updates the binding logic in thermal_sys.c It uses the platform layer data to bind a thermal zone to a cdev for a particular trip point. * If we do not have platform data and do not have .bind defined, do not bind. * If we do not have platform data but .bind is defined, then use tz->ops->bind. * If we have platform data, use it to create binding. The same logic sequence is followed for unbind also. Signed-off-by: Durgadoss R <durgadoss.r@intel.com> Signed-off-by: Zhang Rui <rui.zhang@intel.com>
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