From 3dc748754d68b5893307c3c68acfc67f76110ecf Mon Sep 17 00:00:00 2001 From: Keerthy Date: Tue, 7 Apr 2020 11:21:13 +0530 Subject: dt-bindings: thermal: k3: Add VTM bindings documentation Add VTM bindings documentation. In the Voltage Thermal Management Module(VTM), K3 AM654 supplies a voltage reference and a temperature sensor feature that are gathered in the band gap voltage and temperature sensor (VBGAPTS) module. The band gap provides current and voltage reference for its internal circuits and other analog IP blocks. The analog-to-digital converter (ADC) produces an output value that is proportional to the silicon temperature. Signed-off-by: Keerthy Reviewed-by: Rob Herring Reviewed-by: Amit Kucheria Signed-off-by: Daniel Lezcano Link: https://lore.kernel.org/r/20200407055116.16082-2-j-keerthy@ti.com --- .../bindings/thermal/ti,am654-thermal.yaml | 56 ++++++++++++++++++++++ 1 file changed, 56 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml (limited to 'Documentation') diff --git a/Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml b/Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml new file mode 100644 index 000000000000..25b9209c2e5d --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/ti,am654-thermal.yaml @@ -0,0 +1,56 @@ +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause) +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/ti,am654-thermal.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Texas Instruments AM654 VTM (DTS) binding + +maintainers: + - Keerthy + +properties: + compatible: + const: ti,am654-vtm + + reg: + maxItems: 1 + + power-domains: + maxItems: 1 + + "#thermal-sensor-cells": + const: 1 + +required: + - compatible + - reg + - power-domains + - "#thermal-sensor-cells" + +additionalProperties: false + +examples: + - | + #include + vtm: thermal@42050000 { + compatible = "ti,am654-vtm"; + reg = <0x0 0x42050000 0x0 0x25c>; + power-domains = <&k3_pds 80 TI_SCI_PD_EXCLUSIVE>; + #thermal-sensor-cells = <1>; + }; + + mpu0_thermal: mpu0_thermal { + polling-delay-passive = <250>; /* milliseconds */ + polling-delay = <500>; /* milliseconds */ + thermal-sensors = <&vtm0 0>; + + trips { + mpu0_crit: mpu0_crit { + temperature = <125000>; /* milliCelsius */ + hysteresis = <2000>; /* milliCelsius */ + type = "critical"; + }; + }; + }; +... -- cgit v1.2.3 From 3b25846fbbca2ee3aaa67fe5abb750806d28a98e Mon Sep 17 00:00:00 2001 From: Daniel Lezcano Date: Wed, 29 Apr 2020 12:36:40 +0200 Subject: dt-bindings: thermal: Add the idle cooling device Some devices are not able to cool down by reducing their voltage / frequency because it could be not available or the system does not allow voltage scaling. In this configuration, it is not possible to use this strategy and the idle injection cooling device can be used instead. One idle cooling device is now present for the CPU as implemented by the combination of the idle injection framework belonging to the power capping framework and the thermal cooling device. The missing part is the DT binding providing a way to describe how the cooling device will work on the system. A first iteration was done by making the cooling device to point to the idle state. Unfortunately it does not make sense because it would need to duplicate the idle state description for each CPU in order to have a different phandle and make the thermal internal framework happy. It was proposed to add an cooling-cells to <3>, unfortunately the thermal framework is expecting a value of <2> as stated by the documentation and it is not possible from the cooling device generic code to loop this third value to the back end cooling device. Another proposal was to add a child 'thermal-idle' node as the SCMI does. This approach allows to have a self-contained configuration for the idle cooling device without colliding with the cpufreq cooling device which is based on the CPU node. In addition, it allows to have the cpufreq cooling device and the idle cooling device to co-exist together as shown in the example. Reviewed-by: Rob Herring Signed-off-by: Daniel Lezcano Reviewed-by: Amit Kucheria Link: https://lore.kernel.org/r/20200429103644.5492-2-daniel.lezcano@linaro.org --- .../devicetree/bindings/thermal/thermal-idle.yaml | 145 +++++++++++++++++++++ 1 file changed, 145 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/thermal-idle.yaml (limited to 'Documentation') diff --git a/Documentation/devicetree/bindings/thermal/thermal-idle.yaml b/Documentation/devicetree/bindings/thermal/thermal-idle.yaml new file mode 100644 index 000000000000..7a922f540934 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/thermal-idle.yaml @@ -0,0 +1,145 @@ +# SPDX-License-Identifier: (GPL-2.0-only OR BSD-2-Clause) +# Copyright 2020 Linaro Ltd. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/thermal-idle.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Thermal idle cooling device binding + +maintainers: + - Daniel Lezcano + +description: | + The thermal idle cooling device allows the system to passively + mitigate the temperature on the device by injecting idle cycles, + forcing it to cool down. + + This binding describes the thermal idle node. + +properties: + $nodename: + const: thermal-idle + description: | + A thermal-idle node describes the idle cooling device properties to + cool down efficiently the attached thermal zone. + + '#cooling-cells': + const: 2 + description: | + Must be 2, in order to specify minimum and maximum cooling state used in + the cooling-maps reference. The first cell is the minimum cooling state + and the second cell is the maximum cooling state requested. + + duration-us: + description: | + The idle duration in microsecond the device should cool down. + + exit-latency-us: + description: | + The exit latency constraint in microsecond for the injected + idle state for the device. It is the latency constraint to + apply when selecting an idle state from among all the present + ones. + +required: + - '#cooling-cells' + +examples: + - | + #include + + // Example: Combining idle cooling device on big CPUs with cpufreq cooling device + cpus { + #address-cells = <2>; + #size-cells = <0>; + + /* ... */ + + cpu_b0: cpu@100 { + device_type = "cpu"; + compatible = "arm,cortex-a72"; + reg = <0x0 0x100>; + enable-method = "psci"; + capacity-dmips-mhz = <1024>; + dynamic-power-coefficient = <436>; + #cooling-cells = <2>; /* min followed by max */ + cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>; + thermal-idle { + #cooling-cells = <2>; + duration-us = <10000>; + exit-latency-us = <500>; + }; + }; + + cpu_b1: cpu@101 { + device_type = "cpu"; + compatible = "arm,cortex-a72"; + reg = <0x0 0x101>; + enable-method = "psci"; + capacity-dmips-mhz = <1024>; + dynamic-power-coefficient = <436>; + #cooling-cells = <2>; /* min followed by max */ + cpu-idle-states = <&CPU_SLEEP &CLUSTER_SLEEP>; + thermal-idle { + #cooling-cells = <2>; + duration-us = <10000>; + exit-latency-us = <500>; + }; + }; + + /* ... */ + + }; + + /* ... */ + + thermal_zones { + cpu_thermal: cpu { + polling-delay-passive = <100>; + polling-delay = <1000>; + + /* ... */ + + trips { + cpu_alert0: cpu_alert0 { + temperature = <65000>; + hysteresis = <2000>; + type = "passive"; + }; + + cpu_alert1: cpu_alert1 { + temperature = <70000>; + hysteresis = <2000>; + type = "passive"; + }; + + cpu_alert2: cpu_alert2 { + temperature = <75000>; + hysteresis = <2000>; + type = "passive"; + }; + + cpu_crit: cpu_crit { + temperature = <95000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + + cooling-maps { + map0 { + trip = <&cpu_alert1>; + cooling-device = <&{/cpus/cpu@100/thermal-idle} 0 15 >, + <&{/cpus/cpu@101/thermal-idle} 0 15>; + }; + + map1 { + trip = <&cpu_alert2>; + cooling-device = + <&cpu_b0 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>, + <&cpu_b1 THERMAL_NO_LIMIT THERMAL_NO_LIMIT>; + }; + }; + }; + }; -- cgit v1.2.3 From c1bba2c94decdec382c6a07d9ba722cefd617575 Mon Sep 17 00:00:00 2001 From: Amit Kucheria Date: Fri, 3 Apr 2020 12:31:46 +0530 Subject: dt-bindings: thermal: Add yaml bindings for thermal sensors As part of moving the thermal bindings to YAML, split it up into 3 bindings: thermal sensors, cooling devices and thermal zones. The property #thermal-sensor-cells is required in each device that acts as a thermal sensor. It is used to uniquely identify the instance of the thermal sensor inside the system. Signed-off-by: Amit Kucheria Reviewed-by: Rob Herring Reviewed-by: Lukasz Luba Signed-off-by: Daniel Lezcano Link: https://lore.kernel.org/r/a91b5603caea5b8854cc9f5325448e4c7228c328.1585748882.git.amit.kucheria@linaro.org --- .../bindings/thermal/thermal-sensor.yaml | 72 ++++++++++++++++++++++ 1 file changed, 72 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/thermal-sensor.yaml (limited to 'Documentation') diff --git a/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml b/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml new file mode 100644 index 000000000000..fcd25a0af38c --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/thermal-sensor.yaml @@ -0,0 +1,72 @@ +# SPDX-License-Identifier: (GPL-2.0) +# Copyright 2020 Linaro Ltd. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/thermal-sensor.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Thermal sensor binding + +maintainers: + - Amit Kucheria + +description: | + Thermal management is achieved in devicetree by describing the sensor hardware + and the software abstraction of thermal zones required to take appropriate + action to mitigate thermal overloads. + + The following node types are used to completely describe a thermal management + system in devicetree: + - thermal-sensor: device that measures temperature, has SoC-specific bindings + - cooling-device: device used to dissipate heat either passively or actively + - thermal-zones: a container of the following node types used to describe all + thermal data for the platform + + This binding describes the thermal-sensor. + + Thermal sensor devices provide temperature sensing capabilities on thermal + zones. Typical devices are I2C ADC converters and bandgaps. Thermal sensor + devices may control one or more internal sensors. + +properties: + "#thermal-sensor-cells": + description: + Used to uniquely identify a thermal sensor instance within an IC. Will be + 0 on sensor nodes with only a single sensor and at least 1 on nodes + containing several internal sensors. + enum: [0, 1] + +examples: + - | + #include + + // Example 1: SDM845 TSENS + soc: soc@0 { + #address-cells = <2>; + #size-cells = <2>; + + /* ... */ + + tsens0: thermal-sensor@c263000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0 0x0c263000 0 0x1ff>, /* TM */ + <0 0x0c222000 0 0x1ff>; /* SROT */ + #qcom,sensors = <13>; + interrupts = , + ; + interrupt-names = "uplow", "critical"; + #thermal-sensor-cells = <1>; + }; + + tsens1: thermal-sensor@c265000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0 0x0c265000 0 0x1ff>, /* TM */ + <0 0x0c223000 0 0x1ff>; /* SROT */ + #qcom,sensors = <8>; + interrupts = , + ; + interrupt-names = "uplow", "critical"; + #thermal-sensor-cells = <1>; + }; + }; +... -- cgit v1.2.3 From 73c46acf915385e27f3312e77717d27eff74c08a Mon Sep 17 00:00:00 2001 From: Amit Kucheria Date: Fri, 3 Apr 2020 12:31:47 +0530 Subject: dt-bindings: thermal: Add yaml bindings for thermal cooling-devices As part of moving the thermal bindings to YAML, split it up into 3 bindings: thermal sensors, cooling devices and thermal zones. The property #cooling-cells is required in each device that acts as a cooling device - whether active or passive. So any device that can throttle its performance to passively reduce heat dissipation (e.g. CPUs, GPUs) and any device that can actively dissipate heat at different levels (e.g. fans) will contain this property. Signed-off-by: Amit Kucheria Reviewed-by: Rob Herring Reviewed-by: Lukasz Luba Signed-off-by: Daniel Lezcano Link: https://lore.kernel.org/r/7a9ead7fb67585fb70ab3ffd481e7d567e96970e.1585748882.git.amit.kucheria@linaro.org --- .../bindings/thermal/thermal-cooling-devices.yaml | 116 +++++++++++++++++++++ 1 file changed, 116 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml (limited to 'Documentation') diff --git a/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml new file mode 100644 index 000000000000..5145883d932e --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/thermal-cooling-devices.yaml @@ -0,0 +1,116 @@ +# SPDX-License-Identifier: (GPL-2.0) +# Copyright 2020 Linaro Ltd. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/thermal-cooling-devices.yaml# +$schema: http://devicetree.org/meta-schemas/core.yaml# + +title: Thermal cooling device binding + +maintainers: + - Amit Kucheria + +description: | + Thermal management is achieved in devicetree by describing the sensor hardware + and the software abstraction of cooling devices and thermal zones required to + take appropriate action to mitigate thermal overload. + + The following node types are used to completely describe a thermal management + system in devicetree: + - thermal-sensor: device that measures temperature, has SoC-specific bindings + - cooling-device: device used to dissipate heat either passively or actively + - thermal-zones: a container of the following node types used to describe all + thermal data for the platform + + This binding describes the cooling devices. + + There are essentially two ways to provide control on power dissipation: + - Passive cooling: by means of regulating device performance. A typical + passive cooling mechanism is a CPU that has dynamic voltage and frequency + scaling (DVFS), and uses lower frequencies as cooling states. + - Active cooling: by means of activating devices in order to remove the + dissipated heat, e.g. regulating fan speeds. + + Any cooling device has a range of cooling states (i.e. different levels of + heat dissipation). They also have a way to determine the state of cooling in + which the device is. For example, a fan's cooling states correspond to the + different fan speeds possible. Cooling states are referred to by single + unsigned integers, where larger numbers mean greater heat dissipation. The + precise set of cooling states associated with a device should be defined in + a particular device's binding. + +select: true + +properties: + "#cooling-cells": + description: + Must be 2, in order to specify minimum and maximum cooling state used in + the cooling-maps reference. The first cell is the minimum cooling state + and the second cell is the maximum cooling state requested. + const: 2 + +examples: + - | + #include + #include + + // Example 1: Cpufreq cooling device on CPU0 + cpus { + #address-cells = <2>; + #size-cells = <0>; + + CPU0: cpu@0 { + device_type = "cpu"; + compatible = "qcom,kryo385"; + reg = <0x0 0x0>; + enable-method = "psci"; + cpu-idle-states = <&LITTLE_CPU_SLEEP_0 + &LITTLE_CPU_SLEEP_1 + &CLUSTER_SLEEP_0>; + capacity-dmips-mhz = <607>; + dynamic-power-coefficient = <100>; + qcom,freq-domain = <&cpufreq_hw 0>; + #cooling-cells = <2>; + next-level-cache = <&L2_0>; + L2_0: l2-cache { + compatible = "cache"; + next-level-cache = <&L3_0>; + L3_0: l3-cache { + compatible = "cache"; + }; + }; + }; + + /* ... */ + + }; + + /* ... */ + + thermal-zones { + cpu0-thermal { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 1>; + + trips { + cpu0_alert0: trip-point0 { + temperature = <90000>; + hysteresis = <2000>; + type = "passive"; + }; + }; + + cooling-maps { + map0 { + trip = <&cpu0_alert0>; + /* Corresponds to 1000MHz in OPP table */ + cooling-device = <&CPU0 5 5>; + }; + }; + }; + + /* ... */ + }; +... -- cgit v1.2.3 From 1202a442a31fd2e53cde1a9677d9f7005e48fd6e Mon Sep 17 00:00:00 2001 From: Amit Kucheria Date: Fri, 3 Apr 2020 12:31:48 +0530 Subject: dt-bindings: thermal: Add yaml bindings for thermal zones As part of moving the thermal bindings to YAML, split it up into 3 bindings: thermal sensors, cooling devices and thermal zones. The thermal-zone binding is a software abstraction to capture the properties of each zone - how often they should be checked, the temperature thresholds (trips) at which mitigation actions need to be taken and the level of mitigation needed at those thresholds. Signed-off-by: Amit Kucheria Reviewed-by: Rob Herring Reviewed-by: Lukasz Luba Signed-off-by: Daniel Lezcano Link: https://lore.kernel.org/r/44e5c68bc654ccaf88945f70dc875fa186dd1480.1585748882.git.amit.kucheria@linaro.org --- .../devicetree/bindings/thermal/thermal-zones.yaml | 341 +++++++++++++++++++++ 1 file changed, 341 insertions(+) create mode 100644 Documentation/devicetree/bindings/thermal/thermal-zones.yaml (limited to 'Documentation') diff --git a/Documentation/devicetree/bindings/thermal/thermal-zones.yaml b/Documentation/devicetree/bindings/thermal/thermal-zones.yaml new file mode 100644 index 000000000000..b8515d3eeaa2 --- /dev/null +++ b/Documentation/devicetree/bindings/thermal/thermal-zones.yaml @@ -0,0 +1,341 @@ +# SPDX-License-Identifier: (GPL-2.0) +# Copyright 2020 Linaro Ltd. +%YAML 1.2 +--- +$id: http://devicetree.org/schemas/thermal/thermal-zones.yaml# +$schema: http://devicetree.org/meta-schemas/base.yaml# + +title: Thermal zone binding + +maintainers: + - Amit Kucheria + +description: | + Thermal management is achieved in devicetree by describing the sensor hardware + and the software abstraction of cooling devices and thermal zones required to + take appropriate action to mitigate thermal overloads. + + The following node types are used to completely describe a thermal management + system in devicetree: + - thermal-sensor: device that measures temperature, has SoC-specific bindings + - cooling-device: device used to dissipate heat either passively or actively + - thermal-zones: a container of the following node types used to describe all + thermal data for the platform + + This binding describes the thermal-zones. + + The polling-delay properties of a thermal-zone are bound to the maximum dT/dt + (temperature derivative over time) in two situations for a thermal zone: + 1. when passive cooling is activated (polling-delay-passive) + 2. when the zone just needs to be monitored (polling-delay) or when + active cooling is activated. + + The maximum dT/dt is highly bound to hardware power consumption and + dissipation capability. The delays should be chosen to account for said + max dT/dt, such that a device does not cross several trip boundaries + unexpectedly between polls. Choosing the right polling delays shall avoid + having the device in temperature ranges that may damage the silicon structures + and reduce silicon lifetime. + +properties: + $nodename: + const: thermal-zones + description: + A /thermal-zones node is required in order to use the thermal framework to + manage input from the various thermal zones in the system in order to + mitigate thermal overload conditions. It does not represent a real device + in the system, but acts as a container to link a thermal sensor device, + platform-data regarding temperature thresholds and the mitigation actions + to take when the temperature crosses those thresholds. + +patternProperties: + "^[a-zA-Z][a-zA-Z0-9\\-]{1,12}-thermal$": + type: object + description: + Each thermal zone node contains information about how frequently it + must be checked, the sensor responsible for reporting temperature for + this zone, one sub-node containing the various trip points for this + zone and one sub-node containing all the zone cooling-maps. + + properties: + polling-delay: + $ref: /schemas/types.yaml#/definitions/uint32 + description: + The maximum number of milliseconds to wait between polls when + checking this thermal zone. Setting this to 0 disables the polling + timers setup by the thermal framework and assumes that the thermal + sensors in this zone support interrupts. + + polling-delay-passive: + $ref: /schemas/types.yaml#/definitions/uint32 + description: + The maximum number of milliseconds to wait between polls when + checking this thermal zone while doing passive cooling. Setting + this to 0 disables the polling timers setup by the thermal + framework and assumes that the thermal sensors in this zone + support interrupts. + + thermal-sensors: + $ref: /schemas/types.yaml#/definitions/phandle-array + maxItems: 1 + description: + The thermal sensor phandle and sensor specifier used to monitor this + thermal zone. + + coefficients: + $ref: /schemas/types.yaml#/definitions/uint32-array + description: + An array of integers containing the coefficients of a linear equation + that binds all the sensors listed in this thermal zone. + + The linear equation used is as follows, + z = c0 * x0 + c1 * x1 + ... + c(n-1) * x(n-1) + cn + where c0, c1, .., cn are the coefficients. + + Coefficients default to 1 in case this property is not specified. The + coefficients are ordered and are matched with sensors by means of the + sensor ID. Additional coefficients are interpreted as constant offset. + + sustainable-power: + $ref: /schemas/types.yaml#/definitions/uint32 + description: + An estimate of the sustainable power (in mW) that this thermal zone + can dissipate at the desired control temperature. For reference, the + sustainable power of a 4-inch phone is typically 2000mW, while on a + 10-inch tablet is around 4500mW. + + trips: + type: object + description: + This node describes a set of points in the temperature domain at + which the thermal framework needs to take action. The actions to + be taken are defined in another node called cooling-maps. + + patternProperties: + "^[a-zA-Z][a-zA-Z0-9\\-_]{0,63}$": + type: object + + properties: + temperature: + $ref: /schemas/types.yaml#/definitions/int32 + minimum: -273000 + maximum: 200000 + description: + An integer expressing the trip temperature in millicelsius. + + hysteresis: + $ref: /schemas/types.yaml#/definitions/uint32 + description: + An unsigned integer expressing the hysteresis delta with + respect to the trip temperature property above, also in + millicelsius. Any cooling action initiated by the framework is + maintained until the temperature falls below + (trip temperature - hysteresis). This potentially prevents a + situation where the trip gets constantly triggered soon after + cooling action is removed. + + type: + $ref: /schemas/types.yaml#/definitions/string + enum: + - active # enable active cooling e.g. fans + - passive # enable passive cooling e.g. throttling cpu + - hot # send notification to driver + - critical # send notification to driver, trigger shutdown + description: | + There are four valid trip types: active, passive, hot, + critical. + + The critical trip type is used to set the maximum + temperature threshold above which the HW becomes + unstable and underlying firmware might even trigger a + reboot. Hitting the critical threshold triggers a system + shutdown. + + The hot trip type can be used to send a notification to + the thermal driver (if a .notify callback is registered). + The action to be taken is left to the driver. + + The passive trip type can be used to slow down HW e.g. run + the CPU, GPU, bus at a lower frequency. + + The active trip type can be used to control other HW to + help in cooling e.g. fans can be sped up or slowed down + + required: + - temperature + - hysteresis + - type + additionalProperties: false + + additionalProperties: false + + cooling-maps: + type: object + description: + This node describes the action to be taken when a thermal zone + crosses one of the temperature thresholds described in the trips + node. The action takes the form of a mapping relation between a + trip and the target cooling device state. + + patternProperties: + "^map[-a-zA-Z0-9]*$": + type: object + + properties: + trip: + $ref: /schemas/types.yaml#/definitions/phandle + description: + A phandle of a trip point node within this thermal zone. + + cooling-device: + $ref: /schemas/types.yaml#/definitions/phandle-array + description: + A list of cooling device phandles along with the minimum + and maximum cooling state specifiers for each cooling + device. Using the THERMAL_NO_LIMIT (-1UL) constant in the + cooling-device phandle limit specifier lets the framework + use the minimum and maximum cooling state for that cooling + device automatically. + + contribution: + $ref: /schemas/types.yaml#/definitions/uint32 + minimum: 0 + maximum: 100 + description: + The percentage contribution of the cooling devices at the + specific trip temperature referenced in this map + to this thermal zone + + required: + - trip + - cooling-device + additionalProperties: false + + required: + - polling-delay + - polling-delay-passive + - thermal-sensors + - trips + additionalProperties: false + +examples: + - | + #include + #include + + // Example 1: SDM845 TSENS + soc: soc@0 { + #address-cells = <2>; + #size-cells = <2>; + + /* ... */ + + tsens0: thermal-sensor@c263000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0 0x0c263000 0 0x1ff>, /* TM */ + <0 0x0c222000 0 0x1ff>; /* SROT */ + #qcom,sensors = <13>; + interrupts = , + ; + interrupt-names = "uplow", "critical"; + #thermal-sensor-cells = <1>; + }; + + tsens1: thermal-sensor@c265000 { + compatible = "qcom,sdm845-tsens", "qcom,tsens-v2"; + reg = <0 0x0c265000 0 0x1ff>, /* TM */ + <0 0x0c223000 0 0x1ff>; /* SROT */ + #qcom,sensors = <8>; + interrupts = , + ; + interrupt-names = "uplow", "critical"; + #thermal-sensor-cells = <1>; + }; + }; + + /* ... */ + + thermal-zones { + cpu0-thermal { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 1>; + + trips { + cpu0_alert0: trip-point0 { + temperature = <90000>; + hysteresis = <2000>; + type = "passive"; + }; + + cpu0_alert1: trip-point1 { + temperature = <95000>; + hysteresis = <2000>; + type = "passive"; + }; + + cpu0_crit: cpu_crit { + temperature = <110000>; + hysteresis = <1000>; + type = "critical"; + }; + }; + + cooling-maps { + map0 { + trip = <&cpu0_alert0>; + /* Corresponds to 1400MHz in OPP table */ + cooling-device = <&CPU0 3 3>, <&CPU1 3 3>, + <&CPU2 3 3>, <&CPU3 3 3>; + }; + + map1 { + trip = <&cpu0_alert1>; + /* Corresponds to 1000MHz in OPP table */ + cooling-device = <&CPU0 5 5>, <&CPU1 5 5>, + <&CPU2 5 5>, <&CPU3 5 5>; + }; + }; + }; + + /* ... */ + + cluster0-thermal { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 5>; + + trips { + cluster0_alert0: trip-point0 { + temperature = <90000>; + hysteresis = <2000>; + type = "hot"; + }; + cluster0_crit: cluster0_crit { + temperature = <110000>; + hysteresis = <2000>; + type = "critical"; + }; + }; + }; + + /* ... */ + + gpu-top-thermal { + polling-delay-passive = <250>; + polling-delay = <1000>; + + thermal-sensors = <&tsens0 11>; + + trips { + gpu1_alert0: trip-point0 { + temperature = <90000>; + hysteresis = <2000>; + type = "hot"; + }; + }; + }; + }; +... -- cgit v1.2.3