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The J7200 SoC is a part of the K3 Multicore SoC architecture platform.
It is targeted for automotive gateway, vehicle compute systems,
Vehicle-to-Vehicle (V2V) and Vehicle-to-Everything (V2X) applications.
The SoC aims to meet the complex processing needs of modern embedded
products.
Some highlights of this SoC are:
* Dual Cortex-A72s in a single cluster, two clusters of lockstep
capable dual Cortex-R5F MCUs and a Centralized Device Management and
Security Controller (DMSC).
* Configurable L3 Cache and IO-coherent architecture with high data
throughput capable distributed DMA architecture under NAVSS.
* Integrated Ethernet switch supporting up to a total of 4 external ports
in addition to legacy Ethernet switch of up to 2 ports.
* Upto 1 PCIe-GEN3 controller, 1 USB3.0 Dual-role device subsystems,
20 MCANs, 3 McASP, eMMC and SD, OSPI/HyperBus memory controller, I3C and
I2C, eCAP/eQEP, eHRPWM among other peripherals.
* One hardware accelerator block containing AES/DES/SHA/MD5 called SA2UL
management.
See J7200 Technical Reference Manual (SPRUIU1, June 2020)
for further details: https://www.ti.com/lit/pdf/spruiu1
Add support for detection J7200 SoC
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Signed-off-by: Suman Anna <s-anna@ti.com>
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Add an api soc_is_j721e(), and use it to enable certain functionality
that is available only on j721e. This detection is needed when DT is not
available.
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Signed-off-by: Suman Anna <s-anna@ti.com>
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On HS devices the access to TRNG is restricted on the non-secure
ARM side, disable the node in DT to prevent firewall violations.
Signed-off-by: Andrew F. Davis <afd@ti.com>
Reviewed-by: Lokesh Vutla <lokeshvutla@ti.com>
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Rather than simply parking the R5 core in WFE after starting up ATF
on A53 instead use SYSFW API to properly shut down the R5 CPU cores
as well as associated timer resources that were pre-allocated. This
allows software further downstream to properly and gracefully bring
the R5 cores back online if desired.
Signed-off-by: Andreas Dannenberg <dannenberg@ti.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
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The TI AM654x EVM base board and the associated daughtercards have on-
board I2C-based EEPROMs containing board configuration data. Use the
board detection infrastructure introduced earlier to do the following:
1) Parse the AM654x EVM base board EEPROM and populate items like board
name and MAC addresses into the TI common EEPROM data structure
residing in SRAM scratch space
2) Check for presence of daughter card(s) by probing the associated
presence signals via an I2C-based GPIO expander. Then, if such a
card is found, parse the data such as additional Ethernet MAC
addresses from its on-board EEPROM and populate into U-Boot
accordingly
3) Dynamically create an U-Boot ENV variable called overlay_files
containing a list of daugherboard-specific DTB overlays based on
daughercards found.
This patch adds support for the AM654x base board ("AM6-COMPROCEVM")
as well as for the IDK ("AM6-IDKAPPEVM"), OLDI LCD ("OLDI-LCD1EVM")
PCIe/USB3.0 ("SER-PCIEUSBEVM"), 2 Lane PCIe/USB2.0 ("SER-PCIE2LEVM"),
and general purpuse ("AM6-GPAPPEVM") daughtercards.
Signed-off-by: Andreas Dannenberg <dannenberg@ti.com>
Reviewed-by: Lokesh Vutla <lokeshvutla@ti.com>
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Certain parts of msmc sram can be used by DMSC or can be
marked as L3 cache. Since the available size can vary, changing
DT every time the size varies might be painful. So, query this
information using TISCI cmd and fixup the DT for kernel.
Fixing up DT does the following:
- Create a sram node if not available
- update the reg property with available size
- update ranges property
- loop through available sub nodes and delete it if:
- mentioned size is out if available range
- subnode represents l3 cache or dmsc usage.
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
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Create a wrapper to get the ti sci handle.
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
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K3 based AM654 devices has DDR memory subsystem that comprises
Synopys DDR controller, Synopsis DDR phy and wrapper logic to
intergrate these blocks into the device. This DDR subsystem
provides an interface to external SDRAM devices. Adding support
for the initialization of the external SDRAM devices by
configuring the DDRSS registers and using the buitin PHY
routines.
Reviewed-by: Tom Rini <trini@konsulko.com>
Signed-off-by: Lokesh Vutla <lokeshvutla@ti.com>
Signed-off-by: Andreas Dannenberg <dannenberg@ti.com>
Signed-off-by: Keerthy <j-keerthy@ti.com>
Signed-off-by: Schuyler Patton <spatton@ti.com>
Signed-off-by: James Doublesin <doublesin@ti.com>
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