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Signed-off-by: Wolfgang Denk <wd@denx.de>
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The IGEP module is a low-power, high performance production-ready
system-on-module (SOM) based on TI's OMAP3 family.The IGEP module
solution based upon TI OMAP3 provides a low-power/low-cost platform
for a variety of consumer/industrial/medical devices.
Signed-off-by: Enric Balletbo i Serra <eballetbo@gmail.com>
Signed-off-by: Sandeep Paulraj <s-paulraj@ti.com>
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The IGEP v2 board is a low-cost, fan-less and industrial temperature
range single board computer that unleashes laptop-like performance and
expandability without the bulk, expense, or noise of typical desktop
machines. Its architecture shares much in common with other OMAP3 boards.
Signed-off-by: Enric Balletbo i Serra <eballetbo@gmail.com>
Acked-by: Steve Sakoman <steve.sakoman@linaro.org>
Tested-by: Steve Sakoman <steve.sakoman@linaro.org>
Signed-off-by: Sandeep Paulraj <s-paulraj@ti.com>
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