Age | Commit message (Collapse) | Author |
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Remove duplicated SYS_SOC Kconfig entry from board Kconfig,
because we have this entry in arch/arm/cpu/armv7/mx6/Kconfig.
Signed-off-by: Peng Fan <Peng.Fan@freescale.com>
Cc: Stefano Babic <sbabic@denx.de>
Cc: Heiko Schocher <hs@denx.de>
Cc: Christian Gmeiner <christian.gmeiner@gmail.com>
Cc: Stefan Roese <sr@denx.de>
Cc: Troy Kisky <troy.kisky@boundarydevices.com>
Cc: Nikita Kiryanov <nikita@compulab.co.il>
Cc: "Eric BĂ©nard" <eric@eukrea.com>
Cc: Fabio Estevam <fabio.estevam@freescale.com>
Cc: Tim Harvey <tharvey@gateworks.com>
Cc: Marek Vasut <marex@denx.de>
Cc: Markus Niebel <Markus.Niebel@tq-group.com>
Cc: Otavio Salvador <otavio@ossystems.com.br>
Acked-by: Stefan Roese <sr@denx.de>
Acked-by: Marek Vasut <marex@denx.de>
Acked-by: Christian Gmeiner <christian.gmeiner@gmail.com>
Acked-by: Markus Niebel <Markus.Niebel@tq-group.com>
Acked-by: Troy Kisky <troy.kisky@boundarydevices.com>
Acked-by: Igor Grinberg <grinberg@compulab.co.il>
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Warp has a MAX77696 PMIC connected via I2C1 bus.
Add support for it.
Signed-off-by: Fabio Estevam <fabio.estevam@freescale.com>
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After the mx6 config consolidation, 'save' command is no longer
recognized.
Pass the full command name 'saveenv' instead.
Signed-off-by: Fabio Estevam <fabio.estevam@freescale.com>
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Fix the spelling of 'successful'.
Signed-off-by: Fabio Estevam <fabio.estevam@freescale.com>
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Provide instructions on how to upgrade U-boot in the eMMC.
Signed-off-by: Fabio Estevam <fabio.estevam@freescale.com>
Acked-by: Otavio Salvador <otavio@ossystems.com.br>
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With UMS support we are able to flash the eMMC from U-boot, which is very
convenient.
Add UMS support to make the eMMC flashing process easier.
Signed-off-by: Fabio Estevam <fabio.estevam@freescale.com>
Acked-by: Otavio Salvador <otavio@ossystems.com.br>
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The WaRP Board is a Wearable Reference Plaform. The board features:
- Freescale i.MX6 SoloLite processor with 512MB of RAM
- Freescale FXOS8700CQ 6-axis Xtrinsic sensor
- Freescale Kinetis KL16 MCU
- Freescale Xtrinsic MMA955xL intelligent motion sensing platform
The board implements a hybrid architecture to address the evolving
needs of the wearables market. The platform consists of a main board
and an example daughtercard with the ability to add additional
daughtercards for different usage models.
For more information about the project, visit:
http://www.warpboard.org/
Signed-off-by: Otavio Salvador <otavio@ossystems.com.br>
Reviewed-by: Marek Vasut <marex@denx.de>
Acked-by: Stefano Babic <sbabic@denx.de>
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