Add proper SPD definitions for DDR1/2/3

Also adds helper functions for DDR1/2 to verify the checksum.

Signed-off-by: Kumar Gala <galak@kernel.crashing.org>

1 files changed, 292 insertions, 0 deletions

diff --git a/include/ddr_spd.h b/include/ddr_spd.h
new file mode 100644
index 00000000000..6fdcef0c0af
--- /dev/null
+++ b/include/ddr_spd.h
@@ -0,0 +1,292 @@
+/*
+ * Copyright 2008 Freescale Semiconductor, Inc.
+ *
+ * This program is free software; you can redistribute it and/or
+ * modify it under the terms of the GNU General Public License
+ * Version 2 as published by the Free Software Foundation.
+ */
+
+#ifndef _DDR_SPD_H_
+#define _DDR_SPD_H_
+
+/*
+ * Format from "JEDEC Standard No. 21-C,
+ * Appendix D: Rev 1.0: SPD's for DDR SDRAM
+ */
+typedef struct ddr1_spd_eeprom_s {
+	unsigned char info_size;   /*  0 # bytes written into serial memory */
+	unsigned char chip_size;   /*  1 Total # bytes of SPD memory device */
+	unsigned char mem_type;    /*  2 Fundamental memory type */
+	unsigned char nrow_addr;   /*  3 # of Row Addresses on this assembly */
+	unsigned char ncol_addr;   /*  4 # of Column Addrs on this assembly */
+	unsigned char nrows;       /*  5 Number of DIMM Banks */
+	unsigned char dataw_lsb;   /*  6 Data Width of this assembly */
+	unsigned char dataw_msb;   /*  7 ... Data Width continuation */
+	unsigned char voltage;     /*  8 Voltage intf std of this assembly */
+	unsigned char clk_cycle;   /*  9 SDRAM Cycle time @ CL=X */
+	unsigned char clk_access;  /* 10 SDRAM Access from Clk @ CL=X (tAC) */
+	unsigned char config;      /* 11 DIMM Configuration type */
+	unsigned char refresh;     /* 12 Refresh Rate/Type */
+	unsigned char primw;       /* 13 Primary SDRAM Width */
+	unsigned char ecw;         /* 14 Error Checking SDRAM width */
+	unsigned char min_delay;   /* 15 for Back to Back Random Address */
+	unsigned char burstl;      /* 16 Burst Lengths Supported */
+	unsigned char nbanks;      /* 17 # of Banks on SDRAM Device */
+	unsigned char cas_lat;     /* 18 CAS# Latencies Supported */
+	unsigned char cs_lat;      /* 19 CS# Latency */
+	unsigned char write_lat;   /* 20 Write Latency (aka Write Recovery) */
+	unsigned char mod_attr;    /* 21 SDRAM Module Attributes */
+	unsigned char dev_attr;    /* 22 SDRAM Device Attributes */
+	unsigned char clk_cycle2;  /* 23 Min SDRAM Cycle time @ CL=X-0.5 */
+	unsigned char clk_access2; /* 24 SDRAM Access from
+				         Clk @ CL=X-0.5 (tAC) */
+	unsigned char clk_cycle3;  /* 25 Min SDRAM Cycle time @ CL=X-1 */
+	unsigned char clk_access3; /* 26 Max Access from Clk @ CL=X-1 (tAC) */
+	unsigned char trp;         /* 27 Min Row Precharge Time (tRP)*/
+	unsigned char trrd;        /* 28 Min Row Active to Row Active (tRRD) */
+	unsigned char trcd;        /* 29 Min RAS to CAS Delay (tRCD) */
+	unsigned char tras;        /* 30 Minimum RAS Pulse Width (tRAS) */
+	unsigned char bank_dens;   /* 31 Density of each bank on module */
+	unsigned char ca_setup;    /* 32 Addr + Cmd Setup Time Before Clk */
+	unsigned char ca_hold;     /* 33 Addr + Cmd Hold Time After Clk */
+	unsigned char data_setup;  /* 34 Data Input Setup Time Before Strobe */
+	unsigned char data_hold;   /* 35 Data Input Hold Time After Strobe */
+	unsigned char res_36_40[5];/* 36-40 reserved for VCSDRAM */
+	unsigned char trc;         /* 41 Min Active to Auto refresh time tRC */
+	unsigned char trfc;        /* 42 Min Auto to Active period tRFC */
+	unsigned char tckmax;      /* 43 Max device cycle time tCKmax */
+	unsigned char tdqsq;       /* 44 Max DQS to DQ skew (tDQSQ max) */
+	unsigned char tqhs;        /* 45 Max Read DataHold skew (tQHS) */
+	unsigned char res_46;      /* 46 Reserved */
+	unsigned char dimm_height; /* 47 DDR SDRAM DIMM Height */
+	unsigned char res_48_61[14]; /* 48-61 Reserved */
+	unsigned char spd_rev;     /* 62 SPD Data Revision Code */
+	unsigned char cksum;       /* 63 Checksum for bytes 0-62 */
+	unsigned char mid[8];      /* 64-71 Mfr's JEDEC ID code per JEP-106 */
+	unsigned char mloc;        /* 72 Manufacturing Location */
+	unsigned char mpart[18];   /* 73 Manufacturer's Part Number */
+	unsigned char rev[2];      /* 91 Revision Code */
+	unsigned char mdate[2];    /* 93 Manufacturing Date */
+	unsigned char sernum[4];   /* 95 Assembly Serial Number */
+	unsigned char mspec[27];   /* 99-127 Manufacturer Specific Data */
+
+} ddr1_spd_eeprom_t;
+
+/*
+ * Format from "JEDEC Appendix X: Serial Presence Detects for DDR2 SDRAM",
+ * SPD Revision 1.2
+ */
+typedef struct ddr2_spd_eeprom_s {
+	unsigned char info_size;   /*  0 # bytes written into serial memory */
+	unsigned char chip_size;   /*  1 Total # bytes of SPD memory device */
+	unsigned char mem_type;    /*  2 Fundamental memory type */
+	unsigned char nrow_addr;   /*  3 # of Row Addresses on this assembly */
+	unsigned char ncol_addr;   /*  4 # of Column Addrs on this assembly */
+	unsigned char mod_ranks;   /*  5 Number of DIMM Ranks */
+	unsigned char dataw;       /*  6 Module Data Width */
+	unsigned char res_7;       /*  7 Reserved */
+	unsigned char voltage;     /*  8 Voltage intf std of this assembly */
+	unsigned char clk_cycle;   /*  9 SDRAM Cycle time @ CL=X */
+	unsigned char clk_access;  /* 10 SDRAM Access from Clk @ CL=X (tAC) */
+	unsigned char config;      /* 11 DIMM Configuration type */
+	unsigned char refresh;     /* 12 Refresh Rate/Type */
+	unsigned char primw;       /* 13 Primary SDRAM Width */
+	unsigned char ecw;         /* 14 Error Checking SDRAM width */
+	unsigned char res_15;      /* 15 Reserved */
+	unsigned char burstl;      /* 16 Burst Lengths Supported */
+	unsigned char nbanks;      /* 17 # of Banks on Each SDRAM Device */
+	unsigned char cas_lat;     /* 18 CAS# Latencies Supported */
+	unsigned char mech_char;   /* 19 DIMM Mechanical Characteristics */
+	unsigned char dimm_type;   /* 20 DIMM type information */
+	unsigned char mod_attr;    /* 21 SDRAM Module Attributes */
+	unsigned char dev_attr;    /* 22 SDRAM Device Attributes */
+	unsigned char clk_cycle2;  /* 23 Min SDRAM Cycle time @ CL=X-1 */
+	unsigned char clk_access2; /* 24 SDRAM Access from Clk @ CL=X-1 (tAC) */
+	unsigned char clk_cycle3;  /* 25 Min SDRAM Cycle time @ CL=X-2 */
+	unsigned char clk_access3; /* 26 Max Access from Clk @ CL=X-2 (tAC) */
+	unsigned char trp;         /* 27 Min Row Precharge Time (tRP)*/
+	unsigned char trrd;        /* 28 Min Row Active to Row Active (tRRD) */
+	unsigned char trcd;        /* 29 Min RAS to CAS Delay (tRCD) */
+	unsigned char tras;        /* 30 Minimum RAS Pulse Width (tRAS) */
+	unsigned char rank_dens;   /* 31 Density of each rank on module */
+	unsigned char ca_setup;    /* 32 Addr+Cmd Setup Time Before Clk (tIS) */
+	unsigned char ca_hold;     /* 33 Addr+Cmd Hold Time After Clk (tIH) */
+	unsigned char data_setup;  /* 34 Data Input Setup Time
+				         Before Strobe (tDS) */
+	unsigned char data_hold;   /* 35 Data Input Hold Time
+				         After Strobe (tDH) */
+	unsigned char twr;         /* 36 Write Recovery time tWR */
+	unsigned char twtr;        /* 37 Int write to read delay tWTR */
+	unsigned char trtp;        /* 38 Int read to precharge delay tRTP */
+	unsigned char mem_probe;   /* 39 Mem analysis probe characteristics */
+	unsigned char trctrfc_ext; /* 40 Extensions to trc and trfc */
+	unsigned char trc;         /* 41 Min Active to Auto refresh time tRC */
+	unsigned char trfc;        /* 42 Min Auto to Active period tRFC */
+	unsigned char tckmax;      /* 43 Max device cycle time tCKmax */
+	unsigned char tdqsq;       /* 44 Max DQS to DQ skew (tDQSQ max) */
+	unsigned char tqhs;        /* 45 Max Read DataHold skew (tQHS) */
+	unsigned char pll_relock;  /* 46 PLL Relock time */
+	unsigned char Tcasemax;    /* 47 Tcasemax */
+	unsigned char psiTAdram;   /* 48 Thermal Resistance of DRAM Package from
+				         Top (Case) to Ambient (Psi T-A DRAM) */
+	unsigned char dt0_mode;    /* 49 DRAM Case Temperature Rise from Ambient
+				         due to Activate-Precharge/Mode Bits
+					 (DT0/Mode Bits) */
+	unsigned char dt2n_dt2q;   /* 50 DRAM Case Temperature Rise from Ambient
+				         due to Precharge/Quiet Standby
+					 (DT2N/DT2Q) */
+	unsigned char dt2p;        /* 51 DRAM Case Temperature Rise from Ambient
+				         due to Precharge Power-Down (DT2P) */
+	unsigned char dt3n;        /* 52 DRAM Case Temperature Rise from Ambient
+				         due to Active Standby (DT3N) */
+	unsigned char dt3pfast;    /* 53 DRAM Case Temperature Rise from Ambient
+				         due to Active Power-Down with
+					 Fast PDN Exit (DT3Pfast) */
+	unsigned char dt3pslow;    /* 54 DRAM Case Temperature Rise from Ambient
+				         due to Active Power-Down with Slow
+					 PDN Exit (DT3Pslow) */
+	unsigned char dt4r_dt4r4w; /* 55 DRAM Case Temperature Rise from Ambient
+				         due to Page Open Burst Read/DT4R4W
+					 Mode Bit (DT4R/DT4R4W Mode Bit) */
+	unsigned char dt5b;        /* 56 DRAM Case Temperature Rise from Ambient
+				         due to Burst Refresh (DT5B) */
+	unsigned char dt7;         /* 57 DRAM Case Temperature Rise from Ambient
+				         due to Bank Interleave Reads with
+					 Auto-Precharge (DT7) */
+	unsigned char psiTApll;    /* 58 Thermal Resistance of PLL Package form
+				         Top (Case) to Ambient (Psi T-A PLL) */
+	unsigned char psiTAreg;    /* 59 Thermal Reisitance of Register Package
+				         from Top (Case) to Ambient
+					 (Psi T-A Register) */
+	unsigned char dtpllactive; /* 60 PLL Case Temperature Rise from Ambient
+				         due to PLL Active (DT PLL Active) */
+	unsigned char dtregact;    /* 61 Register Case Temperature Rise from
+				         Ambient due to Register Active/Mode Bit
+					 (DT Register Active/Mode Bit) */
+	unsigned char spd_rev;     /* 62 SPD Data Revision Code */
+	unsigned char cksum;       /* 63 Checksum for bytes 0-62 */
+	unsigned char mid[8];      /* 64 Mfr's JEDEC ID code per JEP-106 */
+	unsigned char mloc;        /* 72 Manufacturing Location */
+	unsigned char mpart[18];   /* 73 Manufacturer's Part Number */
+	unsigned char rev[2];      /* 91 Revision Code */
+	unsigned char mdate[2];    /* 93 Manufacturing Date */
+	unsigned char sernum[4];   /* 95 Assembly Serial Number */
+	unsigned char mspec[27];   /* 99-127 Manufacturer Specific Data */
+
+} ddr2_spd_eeprom_t;
+
+typedef struct ddr3_spd_eeprom_s {
+	/* General Section: Bytes 0-59 */
+	unsigned char info_size_crc;   /*  0 # bytes written into serial memory,
+					     CRC coverage */
+	unsigned char spd_rev;         /*  1 Total # bytes of SPD mem device */
+	unsigned char mem_type;        /*  2 Key Byte / Fundamental mem type */
+	unsigned char module_type;     /*  3 Key Byte / Module Type */
+	unsigned char density_banks;   /*  4 SDRAM Density and Banks */
+	unsigned char addressing;      /*  5 SDRAM Addressing */
+	unsigned char res_6;           /*  6 Reserved */
+	unsigned char organization;    /*  7 Module Organization */
+	unsigned char bus_width;       /*  8 Module Memory Bus Width */
+	unsigned char ftb_div;         /*  9 Fine Timebase (FTB)
+					     Dividend / Divisor */
+	unsigned char mtb_dividend;    /* 10 Medium Timebase (MTB) Dividend */
+	unsigned char mtb_divisor;     /* 11 Medium Timebase (MTB) Divisor */
+	unsigned char tCK_min;         /* 12 SDRAM Minimum Cycle Time */
+	unsigned char res_13;          /* 13 Reserved */
+	unsigned char caslat_lsb;      /* 14 CAS Latencies Supported,
+					     Least Significant Byte */
+	unsigned char caslat_msb;      /* 15 CAS Latencies Supported,
+					     Most Significant Byte */
+	unsigned char tAA_min;         /* 16 Min CAS Latency Time */
+	unsigned char tWR_min;         /* 17 Min Write REcovery Time */
+	unsigned char tRCD_min;        /* 18 Min RAS# to CAS# Delay Time */
+	unsigned char tRRD_min;        /* 19 Min Row Active to
+					     Row Active Delay Time */
+	unsigned char tRP_min;         /* 20 Min Row Precharge Delay Time */
+	unsigned char tRAS_tRC_ext;    /* 21 Upper Nibbles for tRAS and tRC */
+	unsigned char tRAS_min_lsb;    /* 22 Min Active to Precharge
+					     Delay Time */
+	unsigned char tRC_min_lsb;     /* 23 Min Active to Active/Refresh
+					     Delay Time, LSB */
+	unsigned char tRFC_min_lsb;    /* 24 Min Refresh Recovery Delay Time */
+	unsigned char tRFC_min_msb;    /* 25 Min Refresh Recovery Delay Time */
+	unsigned char tWTR_min;        /* 26 Min Internal Write to
+					     Read Command Delay Time */
+	unsigned char tRTP_min;        /* 27 Min Internal Read to Precharge
+					     Command Delay Time */
+	unsigned char tFAW_msb;        /* 28 Upper Nibble for tFAW */
+	unsigned char tFAW_min;        /* 29 Min Four Activate Window
+					     Delay Time*/
+	unsigned char opt_features;    /* 30 SDRAM Optional Features */
+	unsigned char therm_ref_opt;   /* 31 SDRAM Thermal and Refresh Opts */
+	unsigned char res_32_59[28];   /* 32-59 Reserved, General Section */
+
+	/* Module-Specific Section: Bytes 60-116 */
+	union {
+		struct {
+			/* 60 (Unbuffered) Module Nominal Height */
+			unsigned char mod_height;
+			/* 61 (Unbuffered) Module Maximum Thickness */
+			unsigned char mod_thickness;
+			/* 62 (Unbuffered) Reference Raw Card Used */
+			unsigned char ref_raw_card;
+			/* 63 (Unbuffered) Address Mapping from
+			      Edge Connector to DRAM */
+			unsigned char addr_mapping;
+			/* 64-116 (Unbuffered) Reserved */
+			unsigned char res_64_116[53];
+		} unbuffered;
+		struct {
+			/* 60 (Registered) Module Nominal Height */
+			unsigned char mod_height;
+			/* 61 (Registered) Module Maximum Thickness */
+			unsigned char mod_thickness;
+			/* 62 (Registered) Reference Raw Card Used */
+			unsigned char ref_raw_card;
+		} registered;
+		unsigned char uc[57]; /* 60-116 Module-Specific Section */
+	} mod_section;
+
+	/* Unique Module ID: Bytes 117-125 */
+	unsigned char mmid_lsb;        /* 117 Module MfgID Code LSB - JEP-106 */
+	unsigned char mmid_msb;        /* 118 Module MfgID Code MSB - JEP-106 */
+	unsigned char mloc;            /* 119 Mfg Location */
+	unsigned char mdate[2];        /* 120-121 Mfg Date */
+	unsigned char sernum[4];       /* 122-125 Module Serial Number */
+
+	/* CRC: Bytes 126-127 */
+	unsigned char crc[2];          /* 126-127 SPD CRC */
+
+	/* Other Manufacturer Fields and User Space: Bytes 128-255 */
+	unsigned char mpart[18];       /* 128-145 Mfg's Module Part Number */
+	unsigned char mrev[2];         /* 146-147 Module Revision Code */
+
+	unsigned char dmid_lsb;        /* 148 DRAM MfgID Code LSB - JEP-106 */
+	unsigned char dmid_msb;        /* 149 DRAM MfgID Code MSB - JEP-106 */
+
+	unsigned char msd[26];         /* 150-175 Mfg's Specific Data */
+	unsigned char cust[80];        /* 176-255 Open for Customer Use */
+
+} ddr3_spd_eeprom_t;
+
+extern unsigned int ddr1_spd_check(const ddr1_spd_eeprom_t *spd);
+extern void ddr1_spd_dump(const ddr1_spd_eeprom_t *spd);
+extern unsigned int ddr2_spd_check(const ddr2_spd_eeprom_t *spd);
+extern void ddr2_spd_dump(const ddr2_spd_eeprom_t *spd);
+
+/*
+ * Byte 2 Fundamental Memory Types.
+ */
+#define SPD_MEMTYPE_FPM		(0x01)
+#define SPD_MEMTYPE_EDO		(0x02)
+#define SPD_MEMTYPE_PIPE_NIBBLE	(0x03)
+#define SPD_MEMTYPE_SDRAM	(0x04)
+#define SPD_MEMTYPE_ROM		(0x05)
+#define SPD_MEMTYPE_SGRAM	(0x06)
+#define SPD_MEMTYPE_DDR		(0x07)
+#define SPD_MEMTYPE_DDR2	(0x08)
+#define SPD_MEMTYPE_DDR2_FBDIMM	(0x09)
+#define SPD_MEMTYPE_DDR2_FBDIMM_PROBE	(0x0A)
+#define SPD_MEMTYPE_DDR3	(0x0B)
+
+#endif /* _DDR_SPD_H_ */